Skip to main content
Analog Devices MAX13412EESA+T — DC-DC Power Modules

MAX13412EESA+T RS485 Transceiver, Half-Duplex, 500kbps

MPNMAX13412EESA+T
End of Life

Analog Devices MAX13412EESA+T RS485/RS422 transceiver, half-duplex, 500kbps data rate, 6V-28V supply, 8-SOIC exposed pad, -40°C to 85°C, ROHS3.

$5.49Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width) Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX13412EESA+T Technical Specifications
ParameterValue
TypeTransceiver
Mounting typeSurface Mount
Voltage6V ~ 28V
ProtocolRS422, RS485
Operating temperature-40°C ~ 85°C
DuplexHalf
PackageTape & Reel (TR); Cut Tape (CT)
Data rate500kbps
Case8-SOIC (0.154\", 3.90mm Width) Exposed Pad
Receiver hysteresis15 mV
Number of drivers (Receivers)1/1

Product details

Active production — RS485 bus transceiver for industrial nodes

The MAX13412EESA+T is an active-production RS485/RS422 transceiver from Analog Devices, listed under the DC-DC Power Modules category but functionally a half-duplex bus interface IC. Rated for 500kbps data rate with a single driver and single receiver (1/1 configuration), it targets industrial communication links where the bus spans tens to hundreds of meters.

6V-28V supply range and 15 mV hysteresis — noise margin on long bus runs

The 6V to 28V supply range allows direct connection to 12V or 24V industrial rails without an intermediate regulator — a common requirement in factory-floor sensor networks and PLC I/O backplanes. 15 mV of receiver hysteresis filters out noise coupled onto the twisted-pair bus, preventing false edge transitions on long cable runs where signal degradation is expected.

8-SOIC exposed pad — thermal and footprint considerations

Surface-mount assembly with standard SOIC-8 footprint; the exposed pad adds a center-land that requires a solder-paste stencil aperture matching the pad dimensions for void-free reflow.

Frequently asked questions

What package does MAX13412EESA+T use?

The exposed pad requires a thermal land on the PCB.