Skip to main content
Analog Devices MAX13030EETE+ — DC-DC Power Modules

MAX13030EETE+ Voltage Level Translator, 100Mbps, 16-TQFN

MPNMAX13030EETE+
End of Life

Analog Devices MAX13030EETE+ voltage level translator, bidirectional, 6 channels, 100Mbps data rate, 1.62V-3.2V VCCA / 2.2V-3.6V VCCB, open drain / push-pull output, 16-TQFN exposed pad, tube.

$10.5Ref. price · indicative, final on quote
Packaging16-WQFN Exposed Pad
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX13030EETE+ Technical Specifications
ParameterValue
Output typeOpen Drain, Push-Pull
Channel typeBidirectional
Mounting typeSurface Mount
Translator typeVoltage Level
Voltage - VCCA1.62 V ~ 3.2 V
Voltage - VCCB2.2 V ~ 3.6 V
Operating temperature-40°C ~ 85°C (TA)
PackageTube
FeaturesPower Supply Decoupling
Data rate100Mbps
Case16-WQFN Exposed Pad
Number of circuits1
Channels per circuit6

Product details

Bidirectional level translation for mixed-voltage buses

The MAX13030EETE+ is a 6-channel bidirectional voltage level translator from Analog Devices, designed to bridge ICs operating on different supply rails without an external direction signal. It handles data rates up to 100Mbps, which covers SPI, I2C, and UART interfaces running at typical clock speeds. The A-side supply (VCCA) spans 1.62 V to 3.2 V, while the B-side (VCCB) covers 2.2 V to 3.6 V. This means a 1.8 V microcontroller on the A-side can talk directly to a 3.3 V peripheral on the B-side — no extra level-shifter IC or resistor divider needed.

Supply rails and output drive

The translator supports both open-drain and push-pull output types on each channel. Open-drain mode is the natural fit for I2C or wired-OR buses where multiple drivers share a line; push-pull gives the full rail-to-rail swing for SPI or GPIO signals where speed matters. On-chip power-supply decoupling is integrated into the die, reducing the external capacitor count. The 16-WQFN exposed-pad package (4x4 mm) provides a low thermal resistance path to the PCB ground plane — the pad should be soldered to a copper pour for best heat transfer and electrical ground reference.

Frequently asked questions

Is MAX13030EETE+ compatible with 1.8V and 3.3V levels?

Yes. A 1.8 V microcontroller on the A-side can drive a 3.3 V peripheral on the B-side without external level shifting.

What is an equivalent or alternative for MAX13030EETE+?

The closest functional alternatives from Analog Devices share the same translator type but differ in channel count, package, or data rate — confirm the BOM position before substituting.