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Analog Devices MAX13013EXT+T — Analog & Data Acquisition

MAX13013EXT+T Analog Devices Level Translator, 100 Mbps

MPNMAX13013EXT+T
End of Life

Analog Devices MAX13013EXT+T voltage level translator, bidirectional, 100 Mbps data rate, 1.2 V to 3.6 V VCCA / 1.65 V to 3.6 V VCCB, SC-70-6 package, -40°C to +85°C, Tape & Reel.

$4.53Ref. price · indicative, final on quote
Packaging6-TSSOP, SC-88, SOT-363
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MAX13013EXT+T Technical Specifications
ParameterValue
Output typeTri-State, Non-Inverted
Channel typeBidirectional
Mounting typeSurface Mount
Translator typeVoltage Level
Voltage - VCCA1.2 V ~ 3.6 V
Voltage - VCCB1.65 V ~ 3.6 V
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesPower Supply Decoupling
Data rate100Mbps
Case6-TSSOP, SC-88, SOT-363
Number of circuits1
Channels per circuit1

Product details

Active production — BOM-fit note

The MAX13013EXT+T is an active-production bidirectional voltage level translator from Analog Devices, rated for 100 Mbps data rate and housed in a 6-lead SC-70-6 package. The part operates from -40°C to +85°C, fitting industrial-temperature enclosures and outdoor telecom cabinets without derating.

Bidirectional translation at 100 Mbps

The single-channel, bidirectional topology with tri-state, non-inverted output means it handles open-drain or push-pull signals without direction-control logic — the bus direction is determined by the driver on each side. At 100 Mbps, the propagation delay and output rise time are low enough to pass SPI clock lines up to 50 MHz or UART data at full speed without bit errors. The integrated power-supply decoupling feature reduces external bypass capacitor count on the board — one less 0.1 µF cap per rail in the BOM.

Package and supply rails

The SC-70-6 (SOT-363) footprint is 2.0 mm × 1.25 mm, fitting dense mixed-voltage designs where board space is tight — common in portable instruments and sensor interface modules. Surface-mount assembly with Tape & Reel packaging (cut tape also available) suits standard pick-and-place lines; store the reels dry per MSL level (typically MSL 1, but confirm bake requirements for extended shelf storage). RoHS3 compliant — no exemption-based lead content, so the part passes EU and UKCA material declarations without additional paperwork.