Package and mounting
Housed in a 20-TSSOP package with an exposed pad (0.173" body width, 4.40 mm width, 16 leads plus pad), the LT8311EFE#PBF is a surface-mount device. The exposed pad must be soldered to a thermal land on the PCB for heat dissipation — a common requirement for drivers that handle gate charge at high frequency. The supplier device package is designated 20-TSSOP-EP.
Lifecycle and compliance
The LT8311EFE#PBF is listed as Active on the manufacturer's lifecycle status, with no end-of-life notification or last-time-buy window. It is ROHS3 compliant. For new designs or production replenishment, this part is available through independent distribution and is sourced to order against an RFQ — no LTB risk, no forced redesign.
