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Analog Devices LT1991IMS#TRPBF — Microcontrollers & Processors (MCU / MPU / DSP)

Analog Devices LT1991IMS#TRPBF PGA, 560 kHz, 10-MSOP

MPNLT1991IMS#TRPBF
End of Life

Analog Devices LT1991IMS#TRPBF Programmable Gain Amplifier, 560 kHz GBP, 110 kHz -3dB, 0.12 V/µs slew rate, 25 µV offset, 130 µA supply, Rail-to-Rail output, 10-MSOP package, Tape & Reel.

$6.1Ref. price · indicative, final on quote
Packaging10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LT1991IMS#TRPBF Technical Specifications
ParameterValue
Output typeRail-to-Rail
Mounting typeSurface Mount
Amplifier typeProgrammable Gain
Voltage - input offset25 µV
Voltage - supply span2.7 V
Current - supply130µA
Current - input bias2.5 nA
Current - output (Channel)21 mA
Operating temperature-40°C ~ 85°C
-3db bandwidth110 kHz
Gain bandwidth product560 kHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate0.12V/µs
Case10-TFSOP, 10-MSOP (0.118\", 3.00mm Width)
Number of circuits1

Product details

Active production — no obsolescence risk on this BOM line

The LT1991IMS#TRPBF: No minimum order threshold beyond the reel increment.

560 kHz GBP, 110 kHz -3dB — precision signal conditioning

Programmable-gain amplifier with 560 kHz gain-bandwidth product and 110 kHz -3 dB bandwidth. Input offset voltage is 25 µV typical with 2.5 nA input bias current — the offset error at the output after gain is small enough to skip auto-zero calibration in many 12-bit systems. Supply current is 130 µA, output can source or sink 21 mA per channel.

A single-circuit PGA in a 10-MSOP package — one channel per chip, useful when each channel needs independent gain programming or isolation from adjacent paths. The 10-MSOP footprint (3.00 mm width) fits tight multi-layer boards; the 0.50 mm lead pitch demands a controlled soldering profile but is standard for this package class.