What this TDM IC does on the backplane
The DS34S102GN+ is a Time Division Multiplexing (TDM) IC from Analog Devices, designed to aggregate multiple lower-speed data streams into a single higher-speed channel for transport over a shared medium. It is housed in a 256-CSBGA (17x17 mm) package, a fine-pitch BGA that demands careful PCB layout — the 0.80 mm ball pitch leaves little room for via-in-pad without resin-filled vias.
It is ROHS3 Compliant, so it clears the EU RoHS exemption list without needing an exemption certificate for your BOM audit.
Board-fit and handling
The 256-CSBGA package is surface-mount only — no socket. The 17x17 mm body with a 1.0 mm max seated height fits standard telecom line-card profiles. Supplied in Tray packaging, which is typical for BGA devices that need to stay flat through reflow. Do not bake unless the moisture-sensitive level (MSL) on the reel label says so — the tray is not hermetic.