Authentication chip in a 6-TDFN — what this part is
The Maxim Integrated DS28EL15Q+T is a DeepCover® authentication chip — a dedicated security IC, not a general-purpose microcontroller or memory. It is designed for one job: verifying that a connected device or consumable is genuine, using cryptographic handshakes rather than simple ID checks. The part is housed in a 6-TDFN (3x3 mm) package with an exposed pad, which means the thermal pad is the primary heat path and also the ground connection. For a rework tech: the pad is small but the exposed pad helps solder wetting under hot air; just make sure the board footprint has a central thermal via or two to pull heat away during reflow.
Active lifecycle — no obsolescence concern
The DS28EL15Q+T carries an Active product status and is ROHS3 compliant. For a BOM line, this part is safe to qualify for new designs and production runs — no last-time-buy planning needed.
Package and mounting
The package is a 6-WDFN with exposed pad, supplier device package 6-TDFN (3x3 mm). Surface-mount only. The exposed pad is the die attach paddle — it must be soldered to a PCB thermal land for both electrical ground and heat sinking. For a rework station: the pad is about 2.2 mm square, so a standard hot-air nozzle with a 5 mm opening will cover it without overheating adjacent passives. No special moisture sensitivity level is stated, but assume MSL 1 or 2 for a small WDFN; if the reel has been open past the floor-life window, a bake at 125°C for 48 hours is safe.