Package and footprint
The 8-uMAX/uSOP (3.00mm width) package is a compact, surface-mount option for space-constrained PCBs. The MSOP footprint is shared with many other Maxim current-sense and power-management ICs, allowing layout reuse across a product family.
Lifecycle and compliance
The DS2740BU+ is listed as Active in production with ROHS3 compliance.
