600 mA, 3 MHz synchronous buck in a 1.02×1.45 mm WLCSP
It integrates a synchronous rectifier, so no external Schottky diode is needed, and the positive output configuration keeps the BOM simple for point-of-load regulation.
Package and footprint: 5-ball WLCSP
Housed in a 5-WFBGA, WLCSP with a supplier device package size of 1.02x1.45 mm, this part is intended for direct surface-mount assembly on a PCB. The WLCSP (wafer-level chip-scale package) means the die is essentially the package — no plastic overmold — so the footprint is the bare minimum for a 600 mA regulator.
Temperature grade and operating range
The synchronous rectifier maintains efficiency across the full temperature range, and the 3 MHz switching frequency keeps the inductor small enough to fit alongside the WLCSP on a dense board.
