600 Mbps LVDS isolator — two channels, one direction
It pushes 600 Mbps per channel with a 4.5 ns propagation delay, making it a fit for high-speed serial links that need galvanic isolation — think isolated SPI, camera serial interfaces, or ADC data lanes crossing a safety barrier. The 3750 Vrms isolation rating and 25 kV/µs common-mode transient immunity handle the noisy environments you see in motor drives, inverters, and industrial field instruments.
3750 Vrms isolation — what the rating buys you
The 3750 Vrms isolation voltage is a 1-minute hipot rating per basic insulation standards. In practice that means this part can sit on a 300 V working-voltage bus with margin for surge events. The 25 kV/µs CMTI is the spec that matters when a high-side IGBT switches at 10 kHz and the ground plane bounces — below that threshold the output can glitch. This part clears that bar with room to spare for most industrial drives. No integrated DC-DC converter on-chip — the isolated power must come from an external supply or a separate isolated module. The 2.375 V to 2.625 V supply rails are tight; that's LVDS signaling levels, so plan for a clean 2.5 V rail on both sides.
Channel layout: 2/0 — both lanes run side 1 to side 2
Two inputs on side 1, zero inputs on side 2 — this is a pure forward-path isolator. No reverse channel for handshake or acknowledge signals. If your link needs bidirectional data, the sibling ADN4651BRSZ-RL7 (1/1) or ADN4652BRSZ-RL7 (1/1, opposite direction) gives you one lane each way. The unidirectional configuration keeps the propagation delay tight at 4.5 ns max, which matters when you're closing a control loop over an isolation barrier.
20-SSOP package — footprint and creepage
The 20-SSOP body is 5.30 mm wide with 0.65 mm pin pitch — standard SOIC-width footprint, not narrow. The 3750 Vrms rating sets the minimum creepage distance the package must maintain across the isolation barrier; the SSOP form factor delivers that without needing a wider-body SOIC-W. Surface-mount only, MSL rating per the reflow profile. No thermal pad — dissipation is through the leads and package body.
Lifecycle and supply
ADI lists the ADN4650BRSZ-RL7 as Active in the current portfolio.