{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"XCV300-4BG432C4307","brand":"AMD (Xilinx)","brandSlug":"amd-xilinx","productSlug":"XCV300-4BG432C4307","canonicalUrl":"https://icboms.com/amd-xilinx/XCV300-4BG432C4307","factsUrl":"https://icboms.com/api/mcp/products/XCV300-4BG432C4307","rawCanonicalId":null},"summary":{"shortDescription":"Xilinx XCV300-4BG432C4307, Virtex series FPGA, 316 user I/O, 432-ball BGA package, bulk delivery, active lifecycle.","salesMarkdown":"## 316 I/O, 432-ball BGA — what it means for the board The Xilinx XCV300-4BG432C4307 is a Virtex-series FPGA with 316 user I/O. That I/O count drives the layer count and fanout strategy on the PCB — expect at least six layers to escape the BGA without via-in-pad. ## Bulk packaging — what it changes for the line This part ships in bulk, not tape-and-reel or tray. For a pick-and-place line that expects JEDEC trays, bulk delivery means you'll need to transfer parts into a feeder-compatible carrier before the machine can run. For manual assembly or small-run MRO work, bulk is fine — just plan for ESD-safe handling during transfer.","metaTitle":"Xilinx XCV300-4BG432C4307 FPGA, 316 I/O, 432MBGA, Active","metaDescription":"Xilinx XCV300-4BG432C4307 FPGA with 316 I/O in 432-ball BGA. Active lifecycle, bulk packaging. Sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"series":"*","package_type":"Bulk","product_status":"Active","lifecycle_stage":"eol_hot"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$294.66","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/67759edc584992485ce802765a5a64c2.pdf","sourceUrl":null},"ai":{"faq":[{"question":"How many I/O does XCV300-4BG432C4307 have?","answer":"The XCV300-4BG432C4307 provides 316 user I/O in a 432-ball BGA package."},{"question":"What is the pinout of XCV300-4BG432C4307?","answer":"The pinout is defined by the 432-ball BGA footprint for the Virtex XCV300. The exact ball assignment is in the device datasheet — the 316 I/O are mapped to specific balls; the remaining balls are power, ground, and configuration pins."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/amd-xilinx/XCV300-4BG432C4307","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/amd-xilinx/XCV300-4BG432C4307 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-11T19:57:43.715Z","lastPublished":"2026-07-11T19:57:43.715Z","indexable":true}}