{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"TPS62660YFFR","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"TPS62660YFFR","canonicalUrl":"https://icboms.com/texas-instruments/TPS62660YFFR","factsUrl":"https://icboms.com/api/mcp/products/TPS62660YFFR","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments TPS62660YFFR, step-down buck converter, 6 MHz switching frequency, 1 A output, fixed 1.8 V output, synchronous rectification, 6-DSBGA package, -40°C to 85°C.","salesMarkdown":"The 6-DSBGA package (six solder bumps, 0.4 mm pitch typical) is the smallest footprint you'll get for a 1 A regulator — roughly 1.5 mm × 1.5 mm — which means the inductor and output caps shrink accordingly. That 6 MHz switching rate lets you use a 0.47 µH or 1 µH inductor and 4.7 µF to 10 µF ceramic output caps, saving board area on a tight RF or sensor rail. ## Hot-air profile for the DSBGA — will it survive rework? The 6-DSBGA is a wafer-level chip-scale package — no mould compound, just the silicon die with solder bumps. That means the die is exposed on the top side; you need a gentle hot-air profile with a top preheat around 150°C to 160°C and a peak reflow at 245°C to 250°C (lead-free). The thermal mass is tiny, so it heats fast — keep the nozzle 2 mm to 3 mm above the part and watch for the bumps to collapse. Orientation is critical: the pin-1 indicator is a small dot on the top of the die, not a chamfered edge. If you lose the dot, you're guessing. A stencil with 0.3 mm to 0.35 mm apertures for the bumps and a 0.1 mm to 0.125 mm foil thickness works. No underfill is standard for this package, but if the board sees shock or vibration, a drop of low-viscosity underfill around the edge buys reliability. ## Layout checklist — keeping the 6 MHz loop tight At 6 MHz, the switching loop (input cap to VIN to SW to output cap back to GND) must fit under the part — the DSBGA bumps are the loop. Place the 10 µF input ceramic cap within 1 mm of the VIN and GND bumps, using 0.3 mm to 0.4 mm vias to the ground plane. The inductor (0.47 µH to 1 µH, low-DCR shielded type) sits next to the SW bump; keep the trace under 2 mm. Output cap goes between the VOUT bump and the load. The FB bump (if adjustable) is a high-impedance node — keep it clear of the SW and inductor field. A solid ground plane on layer 2 under the DSBGA helps thermal spreading, since the package has no exposed pad.","metaTitle":"TI TPS62660YFFR Buck Converter, 6 MHz, 1 A, 6-DSBGA","metaDescription":"Texas Instruments TPS62660YFFR step-down buck converter, 6 MHz switching, 1 A output, fixed 1.8 V, 6-DSBGA package.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["DC-DC Power Modules"],"specifications":{"Mfr":"Texas Instruments","Series":"-","Package":"Tape & Reel (TR)","Function":"Step-Down","Topology":"Buck","Output Type":"Fixed","Mounting Type":"Surface Mount","Package / Case":"6-UFBGA, DSBGA","Product Status":"Active","lifecycle_stage":"eol_hot","Current - Output":"1A","Number of Outputs":"1","Base Product Number":"TPS62660","Output Configuration":"Positive","Frequency - Switching":"6MHz","Operating Temperature":"-40°C~85°C(TA)","Synchronous Rectifier":"Yes","Voltage - Input (Max)":"5.5V","Voltage - Input (Min)":"2.3V","Voltage - Output (Max)":"-","Supplier Device Package":"6-DSBGA","Voltage - Output (Min/Fixed)":"1.8V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$0.8565","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/b9c701a8a9093caac56c98cd3ea30e6e.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/TPS62660YFFR/alternatives.json"},"ai":{"faq":[{"question":"What compliance documentation does TI provide for the TPS62660YFFR?","answer":"Texas Instruments provides RoHS and REACH compliance documentation for the TPS62660YFFR, standard for active-production ICs. The 6-DSBGA package is lead-free and compatible with lead-free reflow profiles. UL or IEC certification is not typically issued for individual ICs of this class; the end-equipment certification covers the system-level safety standards."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/TPS62660YFFR","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/TPS62660YFFR when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-22T18:03:28.771Z","lastPublished":"2026-07-22T18:03:28.771Z","indexable":true}}