{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"TM4C129DNCZADI3R","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"TM4C129DNCZADI3R","canonicalUrl":"https://icboms.com/texas-instruments/TM4C129DNCZADI3R","factsUrl":"https://icboms.com/api/mcp/products/TM4C129DNCZADI3R","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments Tiva C series TM4C129DNCZADI3R, 32-bit ARM Cortex-M4F MCU, 120 MHz, 1 MB Flash, 256 KB RAM, 6 KB EEPROM, 140 I/O, Ethernet + CAN + USB OTG, 212-NFBGA (10x10), -40 to 85°C.","salesMarkdown":"## 120 MHz Cortex-M4F with integrated Ethernet MAC and dual CAN The connectivity set is the headline feature: an internal Ethernet MAC (10/100), two CAN 2.0 controllers, and a USB OTG (Host/Device) interface coexist on the same die, alongside SSI/SPI, I²C, UART, and QEI peripherals. This makes the part a natural fit for industrial gateway panels, building automation controllers, and motor-drive HMIs where a single MCU handles both real-time control and protocol bridging. The 140 GPIOs and 24-channel 12-bit ADC provide enough mixed-signal headroom for multi-sensor acquisition and parallel actuator PWM outputs without an external FPGA or CPLD. ## 212-NFBGA (10x10) — board integration notes The TM4C129DNCZADI3R is supplied in a 212-ball NFBGA package measuring 10x10 mm with a 0.5 mm ball pitch. This fine-pitch BGA requires a micro-via or HDI-capable PCB stack-up for breakout; a standard 4-layer board with through-hole vias will struggle to route all 140 I/O without adding layers. Plan for a minimum 6-layer stack with staggered or skip vias if signal integrity on the Ethernet differential pair is a concern. The supply range is 2.97 V to 3.63 V, so a single 3.3 V rail suffices. Brown-out reset and power-on reset are integrated, reducing external supervisor IC count.","metaTitle":"Texas Instruments TM4C129DNCZADI3R MCU, ARM Cortex-M4F","metaDescription":"TM4C129DNCZADI3R from TI Tiva C series: 32-bit ARM Cortex-M4F at 120 MHz, 1 MB Flash, 256 KB RAM, 6 KB EEPROM, Ethernet + CAN + USB OTG, 140 I/O, 212-NFBGA","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"Texas Instruments","Speed":"120MHz","Series":"Tiva™ C","Package":"Tape & Reel (TR)","RAM Size":"256K x 8","Core Size":"32-Bit Single-Core","EEPROM Size":"6K x 8","Peripherals":"Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT","Connectivity":"CANbus, EBI/EMI, Ethernet, I²C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG","Mounting Type":"Surface Mount","Number of I/O":"140","Core Processor":"ARM® Cortex®-M4F","Package / Case":"212-VFBGA","Product Status":"Active","Data Converters":"A/D 24x12b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"TM4C129","Program Memory Size":"1MB (1M x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~85°C(TA)","Supplier Device Package":"212-NFBGA (10x10)","Voltage - Supply (Vcc/Vdd)":"2.97V ~ 3.63V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$12.7201","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/5222b8c34747a99607ef48cd37fa2730.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/TM4C129DNCZADI3R/alternatives.json"},"ai":{"faq":[{"question":"Does TM4C129DNCZADI3R support CAN and Ethernet simultaneously?","answer":"Yes. The device integrates an internal Ethernet MAC and two CAN 2.0 controllers that can operate concurrently. This allows a single MCU to bridge an industrial CAN bus to an Ethernet network without an external gateway chip."},{"question":"What is the difference between TM4C129DNCZADI3R and TM4C129DNCPDTI3R?","answer":"The TM4C129DNCPDTI3R is a pin-compatible sibling in a 128-pin TQFP package (vs. the 212-ball NFBGA of the DNCZADI3R). Both share the same Cortex-M4F core, 120 MHz speed, 1 MB Flash, and 256 KB RAM, but the NFBGA variant offers 140 I/O versus the TQFP's fewer GPIOs. The BGA package also has a smaller footprint (10x10 mm) but requires a finer-pitch PCB process."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/TM4C129DNCZADI3R","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/TM4C129DNCZADI3R when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-22T18:03:28.771Z","lastPublished":"2026-07-22T18:03:28.771Z","indexable":true}}