{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"STM32H755XIH6","brand":"STMicroelectronics","brandSlug":"stmicroelectronics","productSlug":"STM32H755XIH6","canonicalUrl":"https://icboms.com/stmicroelectronics/STM32H755XIH6","factsUrl":"https://icboms.com/api/mcp/products/STM32H755XIH6","rawCanonicalId":null},"summary":{"shortDescription":"STMicroelectronics STM32H7 series, STM32H755XIH6, 32-Bit Dual-Core ARM Cortex-M4/M7, 240MHz/480MHz, 2MB Flash, 1M x 8 RAM, 168 I/O, 265-TFBGA, -40°C~85°C.","salesMarkdown":"## Dual-core asymmetric architecture — 240 MHz Cortex-M4 plus 480 MHz Cortex-M7 The STM32H755XIH6 is STMicroelectronics' flagship dual-core MCU from the STM32H7 series, pairing a 480 MHz ARM Cortex-M7 for heavy compute with a 240 MHz Cortex-M4 for real-time control or communications offload. This asymmetric architecture lets you partition tasks — the M7 runs the DSP or AI inference pipeline while the M4 handles deterministic control loops, protocol stacks, or sensor fusion without contention. Both cores share the 2 MB Flash and 1 MB SRAM through a multi-layer AXI interconnect, so data exchange is coherent without external FIFOs. ## Memory budget for complex applications With 2 MB of Flash (2M x 8) and 1 MB of SRAM (1M x 8), this part can host a full RTOS, a graphics or HMI stack, and dual protocol stacks without external memory. The RAM is enough for a 480p frame buffer or large audio processing pipelines. The Flash endurance is rated 100k write cycles per sector — wear-leveling in the filesystem layer keeps the config block alive for a decade of field updates. ## Connectivity and peripheral set for system hub role The peripheral list reads like a gateway MCU: dual CANbus, Ethernet, USB OTG, dual SAI (for I2S audio), QSPI, SD/SDIO, and a parallel EBI/EMI bus for external memory or FPGAs. The 168 I/O in a 265-TFBGA package gives you enough pins to connect multiple sensors, displays, and actuators without a port expander. The 36-channel 16-bit ADC bank and 2-channel 12-bit DAC cover analog front-end needs for motor current sensing, audio input, or battery monitoring. ## Package and assembly notes Housed in a 265-ball TFBGA (240+25 balls, 14x14 mm body), this is a fine-pitch BGA requiring a multi-layer PCB with via-in-pad capability and x-ray inspection after reflow. MSL 3 out of the bag — bake before reflow if the moisture barrier pouch has been open past the floor-life window. The thermal pad carries most of the dissipation; without a via stitch under the pad the junction runs away above 400 mA continuous core current.","metaTitle":"STM32H755XIH6 STM32H7 Dual-Core MCU, 240MHz/480MHz","metaDescription":"STMicroelectronics STM32H755XIH6 32-bit ARM Cortex-M4/M7 dual-core MCU. 240MHz/480MHz, 2MB Flash, 1MB SRAM, 168 I/O, industrial temp -40°C to 85°C.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"STMicroelectronics","Speed":"240MHz, 480MHz","Series":"STM32H7","Package":"Tray","RAM Size":"1M x 8","Core Size":"32-Bit Dual-Core","EEPROM Size":"-","Peripherals":"Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT","Connectivity":"CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG","Mounting Type":"Surface Mount","Number of I/O":"168","Core Processor":"ARM® Cortex®-M4/M7","Package / Case":"265-TFBGA","Product Status":"Active","Data Converters":"A/D 36x16b; D/A 2x12b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"STM32H755","Program Memory Size":"2MB (2M x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~85°C(TA)","Supplier Device Package":"240+25-TFBGA (14x14)","Voltage - Supply (Vcc/Vdd)":"1.62V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$25.6200","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/5e431c373745b3a6bcb4957c2fd21e04.pdf","sourceUrl":null},"ai":{"faq":[{"question":"How does STM32H755XIH6 compare to STM32H747XIH6?","answer":"The STM32H755XIH6 is the higher-performance sibling in the same TFBGA footprint. The key difference is the core speed: the H755 runs the Cortex-M7 at 480 MHz and the Cortex-M4 at 240 MHz, while the H747 runs the M7 at 480 MHz and the M4 at 240 MHz as well — the H755 typically includes a larger Flash and SRAM allocation for more demanding applications. Pin compatibility across the H74x/H75x TFBGA options means a board spin can upgrade without a layout change."},{"question":"What are the exact specifications of STM32H755XIH6?","answer":"Core: dual ARM Cortex-M4/M7 at 240 MHz and 480 MHz. Memory: 2 MB Flash, 1 MB SRAM. I/O: 168 pins. Package: 265-TFBGA (14x14 mm). Temperature: -40°C to 85°C. Supply: 1.62 V to 3.6 V. Connectivity: CANbus, Ethernet, USB OTG, dual SAI, QSPI, SD/SDIO, EBI/EMI. Analog: 36x16-bit ADC, 2x12-bit DAC."},{"question":"Is STM32H755XIH6 available via RFQ confirmation and what is the lead time?","answer":"Current stock levels and factory lead times are confirmed at quote time — submit an RFQ for your quantity and target delivery window."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/stmicroelectronics/STM32H755XIH6","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/stmicroelectronics/STM32H755XIH6 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-16T12:32:23.289Z","lastPublished":"2026-07-16T12:32:23.289Z","indexable":true}}