{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"STM32F427IIH6TR","brand":"STMicroelectronics","brandSlug":"stmicroelectronics","productSlug":"STM32F427IIH6TR","canonicalUrl":"https://icboms.com/stmicroelectronics/STM32F427IIH6TR","factsUrl":"https://icboms.com/api/mcp/products/STM32F427IIH6TR","rawCanonicalId":null},"summary":{"shortDescription":"STMicroelectronics STM32F4 series, ARM® Cortex®-M4 32-Bit MCU, 180MHz, 2MB Flash, 256K x 8 RAM, 140 I/O, CANbus/Ethernet/USB OTG, 1.8V-3.6V, -40°C~85°C, 176+25UFBGA (10x10).","salesMarkdown":"The STM32F427IIH6TR: The 176+25 UFBGA (10x10 mm) package brings 140 I/O lines and a peripheral set: dual CAN, Ethernet MAC, USB OTG, SPI, I2C, UART, and a 24-channel 12-bit ADC plus two 12-bit DACs. The 176+25 UFBGA (10x10 mm) is a fine-pitch BGA with a 0.5 mm ball pitch. That means via-in-pad or microvias on the inner rows unless you route all signals on the top layer — plan for a four-layer board minimum. The package has no exposed thermal pad; heat dissipates through the BGA balls and the PCB copper. Under a hot-air station, pre-bake the board at 125°C for 8 hours if the reel has been open past MSL 3 floor life. Reballing is possible with a stencil and 0.3 mm solder spheres, but the 0.5 mm pitch leaves little room for misalignment — a rework station with split optics is the safe call. ## Active lifecycle — no end-of-life concern on this line item ## What the 180 MHz and 2 MB Flash mean for firmware and system architecture The 2 MB Flash is organised as 1 MB dual-bank, which allows live firmware updates — write to one bank while executing from the other. The 256 KB SRAM is split into 128 KB of main SRAM plus 64 KB of CCM (core-coupled memory) and 64 KB of backup SRAM; the CCM gives zero-wait access for time-critical interrupt handlers. The 140 I/O lines, combined with the connectivity set (Ethernet, CAN, USB OTG, multiple SPI/I2C), mean this MCU can serve as the central controller in a distributed industrial system, handling both fieldbus communication and local sensor acquisition.","metaTitle":"STM32F427IIH6TR STM32F4 MCU, 180MHz, 2MB Flash, 176UFBGA","metaDescription":"STM32F427IIH6TR ARM Cortex-M4 MCU, 180 MHz, 2 MB Flash, 256 KB RAM, 140 I/O, Ethernet, CAN, USB OTG, -40 to 85°C, 176+25 UFBGA.","metaKeywords":null},"attributes":{"series":"STM32F4","packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"STMicroelectronics","Speed":"180MHz","Series":"STM32F4","Package":"Tape & Reel (TR) Cut Tape (CT)","RAM Size":"256K x 8","Core Size":"32-Bit Single-Core","EEPROM Size":"-","Peripherals":"Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT","Connectivity":"CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG","Mounting Type":"Surface Mount","Number of I/O":"140","Core Processor":"ARM® Cortex®-M4","Package / Case":"201-UFBGA","Product Status":"Active","Data Converters":"A/D 24x12b; D/A 2x12b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"STM32F427","Program Memory Size":"2MB (2M x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C ~ 85°C (TA)","Supplier Device Package":"176+25UFBGA (10x10)","Voltage - Supply (Vcc/Vdd)":"1.8V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$19.4600","priceTiers":[{"qty":1,"price":"$19.46000","currency":"USD"},{"qty":10,"price":"$17.88500","currency":"USD"},{"qty":25,"price":"$17.14360","currency":"USD"},{"qty":100,"price":"$15.10480","currency":"USD"},{"qty":250,"price":"$14.36348","currency":"USD"},{"qty":500,"price":"$13.43678","currency":"USD"},{"qty":1500,"price":"$12.32478","currency":"USD"}]},"links":{"datasheetUrl":"https://cdn.icboms.com/fa3522ede21a921b5dbbcb78f05a0a95.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/STM32F427IIH6TR/alternatives.json"},"ai":{"faq":[{"question":"What is the difference between STM32F427IIH6TR and STM32F427IIH6?","answer":"The STM32F427IIH6TR and STM32F427IIH6 share the same silicon die and 176+25 UFBGA package. The only difference is the shipping medium: the TR suffix denotes Tape & Reel packaging for automated assembly, while the base part number (without TR) is typically supplied in trays. Electrical specifications, temperature range, and footprint are identical."},{"question":"What are the main specifications of STM32F427IIH6TR?","answer":"It provides 140 I/O lines, a 24-channel 12-bit ADC, dual 12-bit DACs, and connectivity including Ethernet MAC, dual CAN, USB OTG, SPI, I2C, and UART."},{"question":"What package is STM32F427IIH6TR?","answer":"It comes in a 176+25 UFBGA (10x10 mm) package — a fine-pitch BGA with 0.5 mm ball pitch, surface-mount only."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/stmicroelectronics/STM32F427IIH6TR","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/stmicroelectronics/STM32F427IIH6TR when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}