{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"SPC5775BDK3MME2","brand":"NXP Semiconductors","brandSlug":"nxp","productSlug":"SPC5775BDK3MME2","canonicalUrl":"https://icboms.com/nxp/SPC5775BDK3MME2","factsUrl":"https://icboms.com/api/mcp/products/SPC5775BDK3MME2","rawCanonicalId":null},"summary":{"shortDescription":"NXP MPC57xx series, SPC5775BDK3MME2, 32-Bit Dual-Core MCU, e200z7 core, 220MHz, 4MB Flash, 512K x 8 RAM, 293 I/O, 416-MAPBGA (27x27), -40°C to 125°C.","salesMarkdown":"## Dual-core e200z7 at 220 MHz — what it means for the control loop The NXP SPC5775BDK3MME2 is a 32-bit dual-core MCU from the MPC57xx family, built around two e200z7 cores running at 220 MHz. It carries 4 MB of program Flash and 512K x 8 of RAM, with 293 I/O lines brought out to a 416-MAPBGA package (27x27 mm). This is a safety-architecture part — the dual-core layout supports lockstep or split-mode execution for ASIL-B through ASIL-D applications, which is why you see it specified in automotive powertrain, electric-vehicle inverter control, and industrial servo-drive designs where a single-point fault can't be allowed to corrupt the control loop. ## Peripheral set and analog front-end The peripheral list includes DMA, LVD, POR, and Zipwire inter-core communication. On the analog side there are two eQADC modules handling 40 channels at 12-bit resolution — enough to sample multiple current-sense shunt resistors and rotor-position sensors in a single control cycle. Connectivity covers CANbus, FlexCAN, Ethernet, LINbus, SCI, and SPI, so the part can act as a vehicle-domain gateway or a multi-protocol industrial controller without an external bridge chip. ## Supply range and temperature grade Supply voltage spans 3 V to 5.5 V. The operating temperature range is -40°C to 125°C. ## Package and rework considerations Housed in a 416-MAPBGA (27x27 mm), this is a fine-pitch BGA — not a hand-rework-friendly package unless you have a decent reflow station and a stencil. The 293 I/O count means the ball map is dense; verify the pad layout against the supplier device package drawing before committing the board layout. Orientation is marked on the package, but with a BGA this size, a misaligned reflow is a board scrap. Plan for X-ray inspection on the first build. ## Lifecycle and sourcing That means you can qualify it into a new design without worrying about an imminent EOL. No official second-source alternate is listed in the MPC57xx family for this exact density and package, so plan for single-sourced procurement on this BOM line.","metaTitle":"NXP SPC5775BDK3MME2 MCU, 32-Bit Dual-Core e200z7, 220MHz","metaDescription":"NXP SPC5775BDK3MME2 32-bit dual-core MCU, 220MHz e200z7, 4MB Flash, 512K x 8 RAM, 416-MAPBGA, -40 to 125°C.","metaKeywords":null},"attributes":{"series":"MPC57xx","packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":["DC-DC Power Modules"],"specifications":{"Speed":"220MHz","Series":"MPC57xx","Package":"Tray","RAM Size":"512K x 8","Core Size":"32-Bit Dual-Core","Peripherals":"DMA, LVD, POR, Zipwire","Connectivity":"CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI","Mounting Type":"Surface Mount","Number of I/O":"293","Core Processor":"e200z7","Package / Case":"416-BGA","Data Converters":"A/D 40x12b eQADCx2","Oscillator Type":"External","lifecycle_stage":"eol_hot","Program Memory Size":"4MB (4M x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C ~ 125°C (TA)","Supplier Device Package":"416-MAPBGA (27x27)","Voltage - Supply (Vcc/Vdd)":"3V ~ 5.5V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$46.7","stockQuantity":0,"priceTiers":[{"qty":1,"price":"$46.70000","currency":"USD"},{"qty":10,"price":"$37.88200","currency":"USD"},{"qty":200,"price":"$32.89195","currency":"USD"}]},"links":{"datasheetUrl":"https://www.nxp.com/docs/en/data-sheet/MPC5775E_DS.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the closest pin-compatible alternative to SPC5775BDK3MME2 in the MPC57xx family?","answer":"Within the MPC57xx family, pin-compatible variants exist that differ in Flash density, RAM size, or temperature grade, but no exact pin-compatible second-source alternate is listed for this specific 4 MB / 416-MAPBGA configuration. Check the MPC57xx product selector for sibling parts with the same 416-MAPBGA footprint if you need a drop-in with different memory sizing."},{"question":"What is the core speed and architecture of SPC5775BDK3MME2?","answer":"The SPC5775BDK3MME2 runs a 32-bit dual-core e200z7 architecture at 220 MHz. The dual-core design supports lockstep or split-mode operation for safety-critical applications."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/nxp/SPC5775BDK3MME2","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/nxp/SPC5775BDK3MME2 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}