{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"S25FL164K0XBHV030","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"S25FL164K0XBHV030","canonicalUrl":"https://icboms.com/infineon/S25FL164K0XBHV030","factsUrl":"https://icboms.com/api/mcp/products/S25FL164K0XBHV030","rawCanonicalId":null},"summary":{"shortDescription":"Infineon FL1-K series, 64Mbit SPI NOR Flash, 108MHz Quad I/O, 2.7-3.6V, -40 to 105°C, 24-TBGA (6x8) tray.","salesMarkdown":"## Package and board integration — 24-BGA 6x8 mm The S25FL164K0XBHV030: Housed in a 24-ball TBGA (6x8 mm) package for surface-mount assembly, the 0.80 mm ball pitch demands controlled impedance routing on a multi-layer board to maintain signal integrity at the 108 MHz quad-I/O data rate. The supply decoupling strategy should place a 100 nF MLCC within 2 mm of each VDD ball pair, with a bulk 10 µF capacitor per voltage plane section, to keep the core voltage ripple below 50 mV during simultaneous quad-read bursts.","metaTitle":"Infineon S25FL164K0XBHV030 64Mbit SPI NOR Flash, 108MHz","metaDescription":"Infineon S25FL164K0XBHV030 FL1-K 64Mbit SPI NOR Flash, 108MHz Quad I/O, 2.7-3.6V, -40 to 105°C, 24-TBGA. Obsolete — sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Obsolete","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"title":"S25FL164K0XBHV030","Series":"FL1-K","Package":"Tray","Technology":"FLASH - NOR","Memory Size":"64Mbit","Memory Type":"Non-Volatile","Memory Format":"FLASH","Mounting Type":"Surface Mount","Package / Case":"24-TBGA","Clock Frequency":"108 MHz","lifecycle_stage":"eol_hot","Memory Interface":"SPI - Quad I/O","Voltage - Supply":"2.7V ~ 3.6V","Base Product Number":"S25FL164","Memory Organization":"8M x 8","Operating Temperature":"-40°C ~ 105°C (TA)","Supplier Device Package":"24-BGA (6x8)","Write Cycle Time - Word, Page":"3ms"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/a68b7e99eb04ca36ab30eedaef96990c.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/S25FL164K0XBHV030/alternatives.json"},"ai":{"faq":[{"question":"Does the 24-TBGA package require PCB rework compared to a SOIC-8 SPI Flash footprint?","answer":"Yes — the 24-TBGA (6×8) is a ball-grid array and is not footprint-compatible with SOIC-8 or other gull-wing packages. A board with an existing SOIC-8 land pattern will need rework before a TBGA device can be mounted."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/S25FL164K0XBHV030","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/S25FL164K0XBHV030 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-21T02:27:40.116Z","lastPublished":"2026-07-21T02:27:40.116Z","indexable":true}}