{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"S25FL164K0XBHV023","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"S25FL164K0XBHV023","canonicalUrl":"https://icboms.com/infineon/S25FL164K0XBHV023","factsUrl":"https://icboms.com/api/mcp/products/S25FL164K0XBHV023","rawCanonicalId":null},"summary":{"shortDescription":"Infineon FL1-K series 64Mbit NOR Flash, SPI Quad I/O interface, 108 MHz clock, 2.7–3.6 V supply, -40°C to 105°C, 24-TBGA (8x6) Tape & Reel, 8M × 8 organization, 3 ms write cycle.","salesMarkdown":"The S25FL164K0XBHV023: SPI Quad I/O interface at 108 MHz, 64 Mbit capacity, organized as 8M × 8. Infineon has ended production, so new-stock orders go through independent distribution channels. For existing BOM lines, the surplus channel is the practical path. ## 108 MHz Quad I/O — read performance in context Quad I/O at 108 MHz. Page write cycle time is 3 ms. Surface-mount only; no socket option.","metaTitle":"S25FL164K0XBHV023 NOR Flash, 64Mbit, 108 MHz, SPI Quad I/O","metaDescription":"Infineon FL1-K 64Mbit NOR Flash, SPI Quad I/O, 108 MHz clock, 2.7–3.6 V, -40°C to 105°C, 24-TBGA.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Obsolete","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"title":"S25FL164K0XBHV023","Series":"FL1-K","Package":"Tape & Reel (TR)","Technology":"FLASH - NOR","Memory Size":"64Mbit","Memory Type":"Non-Volatile","Memory Format":"FLASH","Mounting Type":"Surface Mount","Package / Case":"24-TBGA","Clock Frequency":"108 MHz","lifecycle_stage":"eol_hot","Memory Interface":"SPI - Quad I/O","Voltage - Supply":"2.7V ~ 3.6V","Base Product Number":"S25FL164","Memory Organization":"8M x 8","Operating Temperature":"-40°C~105°C(TA)","Supplier Device Package":"24-BGA (8x6)","Write Cycle Time - Word, Page":"3ms"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/7d9913df32b66d1dec79117d154aa352.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/S25FL164K0XBHV023/alternatives.json"},"ai":{"faq":[{"question":"What package does the S25FL164K0XBHV023 use?","answer":"24-TBGA (8 × 6 mm) on Tape & Reel. This is a 24-ball BGA package — not a SOIC, TSOPI, or DIP footprint. Rework requires x-ray inspection and BGA reball tooling sized for the 8 × 6 mm grid."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/S25FL164K0XBHV023","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/S25FL164K0XBHV023 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}