{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"S25FL128SDPBHB210","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"S25FL128SDPBHB210","canonicalUrl":"https://icboms.com/infineon/S25FL128SDPBHB210","factsUrl":"https://icboms.com/api/mcp/products/S25FL128SDPBHB210","rawCanonicalId":null},"summary":{"shortDescription":"Infineon FL-S Automotive NOR Flash, 128 Mbit, SPI Quad I/O, 66 MHz, 2.7–3.6 V, -40°C to 105°C, 24-TBGA (8x6 mm), Tray.","salesMarkdown":"## 128 Mbit NOR flash for automotive firmware storage The S25FL128SDPBHB210 is a 128 Mbit NOR flash from Infineon's FL-S series, organized 16M x 8 and accessed over an SPI Quad I/O interface clocked at 66 MHz. The Quad I/O read reduces the instruction overhead — four data lines per clock cycle instead of one — so the effective throughput for code shadowing or parameter logging lands well above a single-bit SPI part at the same clock rate. NOR flash is the right choice here: random-access read with fast page fetch means the MCU can execute code directly in place (XIP) without copying a bootloader to RAM first. The 128 Mbit density fits a full firmware image plus a redundant bank for over-the-air update staging in an automotive ECU. ## Temperature grade and AEC-Q100 qualification The 105°C ceiling gives margin above the 85°C cabin-grade limit, so the flash retains data retention specs when the ECU sits near a hot exhaust manifold or turbocharger. AEC-Q100 qualification means the part passed the full stress suite: high-temperature operating life (HTOL), temperature cycling, ESD (HBM/CDM), latch-up, and early-life failure rate (ELFR) screening. For a production ECU BOM, that certification replaces the need for a separate qualification run. ## Package and board-fit for the 24-TBGA The BGA footprint demands a solder-paste stencil aperture matched to the ball diameter — a 0.40 mm aperture with 0.45 mm pad diameter keeps the solder joint height within the 0.20–0.30 mm range for reliable second-level interconnect after reflow. No external level translator needed for the SPI bus if the host MCU also runs at 3.3V. No official second-source or pin-compatible cross-reference is listed on the manufacturer record.","metaTitle":"S25FL128SDPBHB210 128 Mbit NOR Flash, SPI Quad I/O, 66 MHz","metaDescription":"Infineon S25FL128SDPBHB210 automotive NOR flash, 128 Mbit, SPI Quad I/O at 66 MHz, AEC-Q100 grade 1, -40°C to 105°C, 24-TBGA.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"title":"S25FL128SDPBHB210","Series":"Automotive, AEC-Q100, FL-S","Package":"Tray","Technology":"FLASH - NOR","Memory Size":"128Mbit","Memory Type":"Non-Volatile","Memory Format":"FLASH","Mounting Type":"Surface Mount","Package / Case":"24-TBGA","Clock Frequency":"66 MHz","lifecycle_stage":"eol_hot","Memory Interface":"SPI - Quad I/O","Voltage - Supply":"2.7V ~ 3.6V","Base Product Number":"S25FL128","Memory Organization":"16M x 8","Operating Temperature":"-40°C ~ 105°C (TA)","Supplier Device Package":"24-BGA (8x6)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$3.3941","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":null,"sourceUrl":null},"ai":{"faq":[{"question":"Does the 24-TBGA package need BGA rework equipment?","answer":"Yes — the 24-TBGA (8x6 mm) is not hand-solderable. BGA rework equipment with optical or X-ray inspection is required. Ball pitch and alloy specs differ from the peer 24-SOICW package, so equipment calibrated for SOIC rework does not transfer directly."},{"question":"Is 2.65 V safe if my 12 V automotive rail sags under LDO load?","answer":"The minimum supply is 2.7 V. A sag to 2.65 V is 50 mV below the datasheet floor — undervoltage lockout behavior at that boundary is lot-dependent and not characterized for safety-critical use. Either tighten the LDO regulation or add rail sequencing margin before committing this part to a 12 V automotive design."},{"question":"Does AEC-Q100 trigger CQI-9 or PPAP for industrial panel builds?","answer":"The chip's AEC-Q100 qualification does not independently mandate CQI-9 or PPAP — those are contract and end-application driven. If your industrial panel feeds a supply chain where the board enters an AEC-Q system downstream, your customer may require PPAP level 3. Confirm with the OEM buyer whether the end-customer flow mandates it."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/S25FL128SDPBHB210","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/S25FL128SDPBHB210 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}