{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"PCA9420UKZ","brand":"NXP Semiconductors","brandSlug":"nxp","productSlug":"PCA9420UKZ","canonicalUrl":"https://icboms.com/nxp/PCA9420UKZ","factsUrl":"https://icboms.com/api/mcp/products/PCA9420UKZ","rawCanonicalId":null},"summary":{"shortDescription":"NXP PCA9420UKZ power management IC for low-power MCU, 3.3V~5.5V supply, -40°C~85°C, 25-WLCSP (2.09x2.09), Tape & Reel, ROHS3, Active.","salesMarkdown":"The PCA9420UKZ: Input supply range is 3.3 V to 5.5 V — this covers single-cell Li-ion (3.6-4.2 V), 3.3 V regulated rails, and 5 V USB VBUS. The part does not require a pre-regulator for any of these common sources, which simplifies the front-end BOM. This suits outdoor IoT nodes, automotive cabin electronics, and industrial sensor modules that see ambient heat but not engine-bay extremes. ## WLCSP footprint and board-fit constraints Housed in a 25-bump WLCSP, 2.09 x 2.09 mm. The 0.4 mm pitch typical of this class demands a controlled solder-paste stencil and a reflow profile matched to the board thickness — the package itself is the floorplan reference for the decoupling capacitor placement. Surface-mount only; the WLCSP has no exposed paddle, so thermal management relies on the PCB copper plane under the die. A four-layer board with a solid ground plane beneath the package is the standard thermal strategy. ## Tape & Reel logistics for the procurement desk Cut Tape works for prototype or low-quantity BOM fills.","metaTitle":"PCA9420UKZ PMIC, 3.3-5.5V, 25-WLCSP, Active","metaDescription":"PCA9420UKZ power management IC for MCU applications. 3.3V~5.5V supply, -40°C~85°C, 25-WLCSP. Active production, ROHS3. Sourced per RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Package":"Tape & Reel (TR); Cut Tape (CT)","Applications":"Microcontroller, MCU","Mounting Type":"Surface Mount","Package / Case":"25-UFBGA, WLCSP","lifecycle_stage":"eol_hot","Voltage - Supply":"3.3V ~ 5.5V","Operating Temperature":"-40°C ~ 85°C (TA)","Supplier Device Package":"25-WLCSP (2.09x2.09)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$3.16","stockQuantity":21,"priceTiers":[{"qty":1,"price":"$3.16000","currency":"USD"},{"qty":10,"price":"$2.84200","currency":"USD"},{"qty":25,"price":"$2.68640","currency":"USD"},{"qty":100,"price":"$2.32820","currency":"USD"},{"qty":250,"price":"$2.20880","currency":"USD"},{"qty":500,"price":"$1.98196","currency":"USD"},{"qty":1000,"price":"$1.67153","currency":"USD"},{"qty":3000,"price":"$1.58796","currency":"USD"},{"qty":6000,"price":"$1.52826","currency":"USD"}]},"links":{"datasheetUrl":null,"sourceUrl":null},"ai":{"faq":[{"question":"What package does PCA9420UKZ use?","answer":"It comes in a 25-bump WLCSP (Wafer-Level Chip Scale Package), 2.09 x 2.09 mm. The fine-pitch BGA-style footprint requires a controlled reflow process and a PCB design that accounts for the 0.4 mm ball pitch."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/nxp/PCA9420UKZ","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/nxp/PCA9420UKZ when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-22T19:45:10.375Z","lastPublished":"2026-07-22T19:45:10.375Z","indexable":true}}