{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"MSP430G2252TDA2","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"MSP430G2252TDA2","canonicalUrl":"https://icboms.com/texas-instruments/MSP430G2252TDA2","factsUrl":"https://icboms.com/api/mcp/products/MSP430G2252TDA2","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments MSP430G2252TDA2, 16-bit MSP430 CPU16, 16 MHz, 2 KB Flash, 256 x 8 RAM, 8-ch 10-bit ADC, I²C/SPI/USI, die, -40°C to 85°C, 1.8 V to 3.6 V.","salesMarkdown":"## Bare-die MSP430 for embedded and hybrid builds The die form factor eliminates the package overhead and saves board area, but it also means the part is not socketed or rework-friendly in the usual sense; assembly requires die-attach and wire-bonding capability. ## Memory budget and peripheral set — what fits in 2 KB With 2 KB Flash and 256 bytes of RAM, the firmware must be lean. The MSP430G2252TDA2 includes a 10-bit ADC with 8 multiplexed channels, a USI module supporting I²C and SPI, a PWM timer, brown-out detect, and a DMA controller — enough to handle a few analog sensors, a serial link to a host, and a control loop without external glue logic. The 16 I/O pins provide adequate headroom for a small keypad, LED indicators, or a parallel LCD interface. Designs that need more than 2 KB of code should look at the 4 KB or 8 KB Flash variants in the same die family (MSP430G2xx series), though the pin-compatibility and die footprint may differ. ## Die handling and assembly considerations There is no plastic or ceramic package — the silicon is the component. This changes the procurement and assembly process: the die requires a clean-room environment, die-attach epoxy or solder preform, and wire bonding to the substrate or PCB. Moisture sensitivity is inherent to the raw silicon; storage in a dry, inert atmosphere is recommended until assembly. For a packaged equivalent, the MSP430G2252 (without the TDA2 suffix) comes in a standard TSSOP or QFN package and is a drop-in functional match, though the board footprint and assembly process are completely different. For dual-sourcing resilience, the packaged MSP430G2252 (TSSOP-20 or QFN-20) is a functional equivalent, though the board-level assembly differs.","metaTitle":"TI MSP430G2252TDA2 16-bit MCU, 16 MHz, 2 KB Flash, Die","metaDescription":"Texas Instruments MSP430G2252TDA2 16-bit MCU, 16 MHz core, 2 KB Flash, 256 B RAM, 8-ch 10-bit ADC, die form. Active lifecycle.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"Texas Instruments","Speed":"16MHz","Series":"MSP430G2xx","Package":"Tray","RAM Size":"256 x 8","Core Size":"16-Bit","EEPROM Size":"-","Peripherals":"Brown-out Detect/Reset, DMA, POR, PWM, WDT","Connectivity":"I²C, SPI, USI","Mounting Type":"Surface Mount","Number of I/O":"16","Core Processor":"MSP430 CPU16","Package / Case":"Die","Product Status":"Active","Data Converters":"A/D 8x10b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"MSP430G2252","Program Memory Size":"2KB (2K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~85°C(TA)","Supplier Device Package":"Die","Voltage - Supply (Vcc/Vdd)":"1.8V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$12.7760","priceTiers":null},"links":{"datasheetUrl":null,"sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/MSP430G2252TDA2/alternatives.json"},"ai":{"faq":[{"question":"What is the difference between MSP430G2252TDA2 and MSP430G2252?","answer":"The MSP430G2252TDA2 is the bare-die version of the MSP430G2252. The packaged MSP430G2252 comes in a TSSOP-20 or QFN-20 plastic package, while the TDA2 suffix indicates die form. The functional specifications — 16 MHz core, 2 KB Flash, 256 B RAM, 10-bit ADC, I²C/SPI — are identical. The choice is purely about assembly method: die for hybrid/MCM/COB, packaged for standard PCB reflow."},{"question":"Can MSP430G2252TDA2 be used with MSP430 LaunchPad?","answer":"The MSP430G2252TDA2 is a bare die and cannot be plugged into a LaunchPad socket directly. The LaunchPad ecosystem uses packaged DIP or TSSOP devices. For development and prototyping, use the packaged MSP430G2252 (TSSOP-20) on a LaunchPad or a custom breakout board, then migrate to the die version for production."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/MSP430G2252TDA2","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/MSP430G2252TDA2 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-22T18:03:28.771Z","lastPublished":"2026-07-22T18:03:28.771Z","indexable":true}}