{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"MSP430F5509IZQE","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"MSP430F5509IZQE","canonicalUrl":"https://icboms.com/texas-instruments/MSP430F5509IZQE","factsUrl":"https://icboms.com/api/mcp/products/MSP430F5509IZQE","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments MSP430F5509IZQE, 16-bit MSP430 CPUXV2, 25 MHz, 24 KB Flash, 6 KB SRAM, USB 2.0 full-speed device/host/OTG, multi-protocol serial, 47 GPIO, 1.8–3.6 V, -40 to 85°C, 80-ball BGA MICROSTAR JUNIOR (5×5), tray.","salesMarkdown":"## 25 MHz core, USB 2.0, and the 80-ball BGA — what this MSP430 variant brings Forty-seven GPIO lines and a 12-channel 10-bit ADC round out the peripheral set. This means TI has ceased production and no further factory orders are accepted. ## 24 KB Flash and 6 KB SRAM — sizing the firmware budget With 24 KB of Flash and 6 KB of SRAM, this MCU sits in the mid-range of the MSP430F5xx family. The USB stack and a typical application firmware will consume roughly half that Flash, leaving headroom for moderate feature expansion. The 6 KB SRAM is adequate for USB packet buffers and a modest call stack, but designs with large data arrays or multiple communication buffers should verify memory fit early. The 6K x 8 SRAM organization is byte-addressable, matching the CPUXV2's 16-bit word access pattern. ## 80-ball BGA MICROSTAR JUNIOR — board-level considerations The 80-BGA MICROSTAR JUNIOR package (5×5 mm) is a fine-pitch ball-grid array. The 0.5 mm or 0.65 mm ball pitch (TI documentation specifies the exact footprint) requires controlled impedance routing, via-in-pad for dense designs, and X-ray inspection after reflow. The package is surface-mount only. ## USB 2.0 and multi-protocol serial — what the connectivity means The USB 2.0 full-speed (12 Mbps) interface supports device, host, and OTG modes, making this part suitable for USB dongles, data loggers with direct PC connection, or portable devices that act as USB hosts for keyboards or memory sticks. The multi-protocol serial engine — I²C, SPI, UART, LIN, IrDA — runs concurrently with USB, so a single chip can handle USB communication while managing a sensor bus over I²C or driving a display over SPI. The 47 GPIO lines provide ample room for local control and status signals.","metaTitle":"TI MSP430F5509IZQE 16-bit MCU, 25 MHz, 24 KB Flash, 80-BGA","metaDescription":"Texas Instruments MSP430F5509IZQE: 16-bit MSP430 CPUXV2 at 25 MHz, 24 KB Flash, 6 KB SRAM, USB 2.0, multi-protocol serial, 47 GPIO, -40 to 85°C, 80-ball BGA.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Obsolete","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"Texas Instruments","Speed":"25MHz","Series":"MSP430F5xx","Package":"Tray","RAM Size":"6K x 8","Core Size":"16-Bit","EEPROM Size":"-","Peripherals":"Brown-out Detect/Reset, DMA, POR, PWM, WDT","Connectivity":"I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB","Mounting Type":"Surface Mount","Number of I/O":"47","Core Processor":"MSP430 CPUXV2","Package / Case":"80-VFBGA","Product Status":"Obsolete","Data Converters":"A/D 12x10b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"MSP430F5509","Program Memory Size":"24KB (24K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~85°C(TA)","Supplier Device Package":"80-BGA MICROSTAR JUNIOR (5x5)","Voltage - Supply (Vcc/Vdd)":"1.8V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/544436086032f68cae8e07bc17bbd9f2.pdf","sourceUrl":null},"ai":{"faq":[{"question":"Is MSP430F5509IZQE obsolete and what is the recommended replacement?","answer":"TI has not published a direct pin-compatible successor for this exact order code. For a like-for-like replacement, the closest functional match within the MSP430F5xx USB family would be a current-production variant such as the MSP430F5529 or MSP430F5508 — but these differ in memory size, package options, or peripheral set. A pin-to-pin comparison against the existing PCB layout is essential before any substitution. For the exact MSP430F5509IZQE, procurement goes through independent distribution against an RFQ."},{"question":"What is the difference between MSP430F5509IZQE and MSP430F5509IZQER?","answer":"The two order codes share the same silicon and package (MSP430F5509, 80-BGA MICROSTAR JUNIOR). The suffix difference indicates shipping medium: IZQE ships in tray, while IZQER ships in tape and reel. Electrically and functionally they are identical."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/MSP430F5509IZQE","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/MSP430F5509IZQE when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}