{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"MSP430F2132CY","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"MSP430F2132CY","canonicalUrl":"https://icboms.com/texas-instruments/MSP430F2132CY","factsUrl":"https://icboms.com/api/mcp/products/MSP430F2132CY","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments MSP430F2xx series MSP430F2132CY, 16-bit MCU, 16 MHz, 8KB Flash, 512 x 8 RAM, I²C/SPI/UART, 24 I/O, die form, 1.8 V to 3.6 V supply.","salesMarkdown":"## Bare-die MSP430 — what this package means for the build The die form factor is the key differentiator here: no lead frame, no plastic overmold — the silicon is the component. ## Die handling and assembly — the procurement angle Because this part ships as a bare die, the usual SMT pick-and-place and reflow assumptions do not apply. The die requires a wafer-level or chip-on-board assembly process — wire bonding or flip-chip attach, plus die-attach epoxy or solder preform. That means the buyer needs to verify that their assembly house supports die-level handling, including wafer dicing, die pick, and bond-pad alignment. The supplier device package field lists 'Diesale', which indicates the die is sold as a known-good die, not as a sawn wafer. Plan for ESD-sensitive handling throughout the supply chain; the die has no protective overmold. The mounting type is surface mount, but that refers to the die being attached to a substrate, not to a conventional PCB pad layout. ## Lifecycle status — still in active production That said, the die form factor limits the pool of distributors who carry it — it is not a jellybean part stocked in high volume. No LTB risk to budget for the foreseeable future. ## Memory and I/O — sizing the firmware and bus The 8 KB Flash (8K x 8 plus 256 B) and 512 x 8 RAM set a clear boundary for firmware size and runtime data. The 512-byte RAM handles small buffers and a modest call stack; interrupt-heavy designs will need to watch stack depth. The 24 I/O pins give enough headroom for a keypad, a small LCD segment driver, or a sensor array, but not for a memory-mapped display or a parallel bus.","metaTitle":"TI MSP430F2132CY 16-bit MCU, 8KB Flash, 16 MHz, bare die","metaDescription":"Texas Instruments MSP430F2132CY 16-bit MCU with 8KB Flash, 512B RAM, 16 MHz core, supplied as bare die.","metaKeywords":null},"attributes":{"series":"MSP430F2xx","packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Mfr":"Texas Instruments","Speed":"16MHz","Series":"MSP430F2xx","Package":"Tray","RAM Size":"512 x 8","Core Size":"16-Bit","EEPROM Size":"-","Peripherals":"Brown-out Detect/Reset, POR, PWM, WDT","Connectivity":"I²C, IrDA, LINbus, SCI, SPI, UART/USART","Mounting Type":"Surface Mount","Number of I/O":"24","Core Processor":"MSP430 CPU16","Package / Case":"Die","Product Status":"Active","Data Converters":"A/D 8x10b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"MSP430F2132","Program Memory Size":"8KB (8K x 8 + 256B)","Program Memory Type":"FLASH","Operating Temperature":"-","Supplier Device Package":"Diesale","Voltage - Supply (Vcc/Vdd)":"1.8V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$7.1900","priceTiers":[{"qty":1,"price":"$7.19000","currency":"USD"},{"qty":10,"price":"$6.46000","currency":"USD"},{"qty":25,"price":"$6.10720","currency":"USD"},{"qty":80,"price":"$5.29313","currency":"USD"},{"qty":230,"price":"$5.02165","currency":"USD"},{"qty":500,"price":"$4.50590","currency":"USD"},{"qty":1000,"price":"$3.80016","currency":"USD"},{"qty":2500,"price":"$3.61015","currency":"USD"}]},"links":{"datasheetUrl":"https://cdn.icboms.com/c5a92866ecf3ca6b42522ffa2a7cce70.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/MSP430F2132CY/alternatives.json"},"ai":{"faq":[{"question":"Is the MSP430F2132CY a bare die?","answer":"Yes. The MSP430F2132CY is supplied as a bare die (package / case: Die, supplier device package: Diesale). It has no molded package, no lead frame, and no plastic overmold. This is the key difference from the standard MSP430F2132 in a TSSOP or QFN package."},{"question":"What is the difference between the MSP430F2132CY and the MSP430F2132?","answer":"The only difference is the package form. The MSP430F2132CY is a bare die (Die package), while the standard MSP430F2132 ships in a molded plastic package (typically a 28-pin TSSOP or QFN). The silicon is identical — same 16-bit MSP430 CPU16 core, same 8 KB Flash, same 512 x 8 RAM, same 16 MHz speed, same peripheral set. The choice between them is purely a board-level assembly decision: die for chip-on-board or MCM, molded package for conventional SMT."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/MSP430F2132CY","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/MSP430F2132CY when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}