{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"LPC1342FHN33,518","brand":"NXP USA Inc.","brandSlug":"nxp-usa-inc","productSlug":"LPC1342FHN33~6518","canonicalUrl":"https://icboms.com/nxp-usa-inc/LPC1342FHN33~6518","factsUrl":"https://icboms.com/api/mcp/products/LPC1342FHN33%2C518","rawCanonicalId":null},"summary":{"shortDescription":"NXP LPC1342FHN33,518 — 32-bit ARM Cortex-M3 MCU, 72MHz, 16KB Flash, 4KB SRAM, USB device/OTG, I²C/SPI/SSP/UART, 28 I/O, 32-VQFN exposed pad (7×7mm), -40°C to 85°C, 2V–3.6V, Tape & Reel.","salesMarkdown":null,"metaTitle":"NXP LPC1342FHN33,518 — ARM Cortex-M3 MCU, 72MHz, 16KB Flash, USB","metaDescription":"NXP LPC1342FHN33,518 is a 32-bit ARM Cortex-M3 MCU running at 72MHz with 16KB Flash, 4KB SRAM, USB device, 28 I/O, in a 32-VQFN package, rated -40 to 85°C. Active lifecycle.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Speed":"72MHz","title":"LPC1342FHN33,518","Series":"LPC13xx","Package":"Tape & Reel (TR)","RAM Size":"4K x 8","Core Size":"32-Bit Single-Core","Peripherals":"Brown-out Detect/Reset, POR, WDT","Connectivity":"I²C, Microwire, SPI, SSI, SSP, UART/USART, USB","Mounting Type":"Surface Mount","Number of I/O":"28","Core Processor":"ARM® Cortex®-M3","Package / Case":"32-VQFN Exposed Pad","Data Converters":"A/D 8x10b","Oscillator Type":"Internal","Base Product Number":"LPC1342","Program Memory Size":"16KB (16K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C ~ 85°C (TA)","Supplier Device Package":"32-HVQFN (7x7)","Voltage - Supply (Vcc/Vdd)":"2V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$3.4531","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/f2c1b8de7a2e4892c983c6b2f1d12ead.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/LPC1342FHN33%2C518/alternatives.json"},"ai":{"faq":[{"question":"Does the 32-VQFN exposed pad require thermal vias to the ground plane?","answer":"Yes — the exposed pad must be soldered to a thermal land under the device for rated thermal performance. The specific θJA values for still air versus forced convection are datasheet parameters not carried in the summary ledger."},{"question":"Can all 28 I/O pins be used as GPIO if USB is not populated?","answer":"The two pins shared with USB D+/D- become available as standard GPIO in non-USB builds — no board respin is required for that reallocation. All other peripherals route independently."},{"question":"Is the 4KB SRAM sufficient for a USB CDC/Virtual COM driver at 72MHz?","answer":"It is tight but workable — a USB CDC driver with ISR buffers can consume 1.5–2KB, leaving 2–2.5KB for application code. Exact contiguous SRAM availability for USB device operation is a register-level datasheet detail, not a ledger field."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/nxp-usa-inc/LPC1342FHN33~6518","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/nxp-usa-inc/LPC1342FHN33~6518 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-16T10:39:33.080Z","lastPublished":"2026-07-16T10:39:33.080Z","indexable":true}}