{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"LM3S817-EGZ50-C2","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"LM3S817-EGZ50-C2","canonicalUrl":"https://icboms.com/texas-instruments/LM3S817-EGZ50-C2","factsUrl":"https://icboms.com/api/mcp/products/LM3S817-EGZ50-C2","rawCanonicalId":null},"summary":{"shortDescription":"Texas Instruments Stellaris LM3S817-EGZ50-C2, ARM Cortex-M3 32-bit MCU, 50 MHz, 64 KB Flash, 8 KB SRAM, 30 I/O, 6x10-bit ADC, -40 to 105°C, 48-VQFN exposed pad, Tray.","salesMarkdown":"The Texas Instruments LM3S817-EGZ50-C2 is a 32-bit ARM Cortex-M3 microcontroller from the Stellaris series, clocked at 50 MHz with 64 KB of Flash and 8 KB of SRAM. It operates from -40 to 105°C. ## Lifecycle reality — EOL hot","metaTitle":"Texas Instruments LM3S817-EGZ50-C2 ARM Cortex-M3 MCU, 50 MHz","metaDescription":"Texas Instruments Stellaris LM3S817-EGZ50-C2 ARM Cortex-M3 MCU, 50 MHz, 64 KB Flash, 8 KB SRAM, -40 to 105°C, 48-VQFN. Sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Speed":"50MHz","title":"LM3S817-EGZ50-C2","Series":"Stellaris® ARM® Cortex®-M3S 800","Package":"Tray","RAM Size":"8K x 8","Core Size":"32-Bit Single-Core","Peripherals":"Brown-out Detect/Reset, POR, PWM, WDT","Connectivity":"Microwire, SPI, SSI, UART/USART","Mounting Type":"Surface Mount","Number of I/O":"30","Core Processor":"ARM® Cortex®-M3","Package / Case":"48-VFQFN Exposed Pad","Data Converters":"A/D 6x10b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"LM3S817","Program Memory Size":"64KB (64K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~105°C(TA)","Supplier Device Package":"48-VQFN (7x7)","Voltage - Supply (Vcc/Vdd)":"3V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/c076c2f838e276f7287b4eb345e697c1.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/LM3S817-EGZ50-C2/alternatives.json"},"ai":{"faq":[{"question":"Is the LM3S817-EGZ50-C2 still available, and what replaces it?","answer":"The part is eol_hot with an Active distributor listing — available stock is finite and will not be replenished once the last-time-buy window closes. There is no TI-documented pin-compatible drop-in successor for the LM3S817-EGZ50-C2. The Stellaris family was superseded by the Tiva C Series (TM4Cxxx), which carries a different register map and pinout, meaning firmware migration and board layout changes are required for any replacement design."},{"question":"Does the 6-channel 10-bit ADC share pins with the SPI/SSI interfaces on the LM3S817?","answer":"On the Stellaris family the ADC inputs are muxed onto shared device pins — whether a given ADC channel is available concurrently with a specific SPI/SSI pin depends on the alternate function assignment for that package pin, which the device datasheet pinout table governs. Before assuming simultaneous availability of all six ADC channels and all serial interfaces, verify the alternate function map for the 48-VFQFN pinout to confirm no resource conflicts in your specific pin allocation."},{"question":"What are the thermal and assembly requirements for the 48-VFQFN exposed pad at sustained 50MHz industrial ambient?","answer":"The exposed pad on the 48-VFQFN must be soldered to the PCB pad — it is the primary thermal path from the die to the board, not a mechanical feature. Sustained 50MHz operation at 85°C ambient typically requires thermal vias beneath the pad and adequate copper area on the board layer below. The datasheet thermal resistance junction-to-case figure determines whether passive cooling suffices or whether the design needs active thermal management; the -40 to 105°C operating rating assumes the device die stays within its junction temperature limit per the thermal layout on the host board."},{"question":"How do I migrate from the LM3S817 to a current TI ARM Cortex-M part?","answer":"The Stellaris-to-Tiva migration requires firmware porting because the register definition headers and peripheral driver library changed between the two families. The Tiva TM4C series is the functional successor — it runs the same ARM Cortex-M3 core at higher clock speeds with an expanded peripheral set. Pinout and package differ from the 48-VFQFN, so a board revision is mandatory. TI provides migration guides for Stellaris-to-Tiva porting; an IAR or Keil project retargets by swapping the device header files and rebuilding, with peripheral API calls requiring the most rework."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/LM3S817-EGZ50-C2","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/LM3S817-EGZ50-C2 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}