{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"LM3S800-EGZ50-C2","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"LM3S800-EGZ50-C2","canonicalUrl":"https://icboms.com/texas-instruments/LM3S800-EGZ50-C2","factsUrl":"https://icboms.com/api/mcp/products/LM3S800-EGZ50-C2","rawCanonicalId":null},"summary":{"shortDescription":"Stellaris LM3S800-EGZ50-C2, ARM Cortex-M3S core at 50MHz, 64KB FLASH / 8KB SRAM, 36 I/O, I²C/SPI/SSI/UART, 48-VFQFN 7×7mm exposed pad, -40°C to 105°C, 3.0–3.6V supply, tray.","salesMarkdown":null,"metaTitle":"LM3S800-EGZ50-C2 Stellaris ARM Cortex-M3S MCU 50MHz 64KB Flash","metaDescription":"Stellaris ARM Cortex-M3S 800 series MCU, 50MHz, 64KB FLASH, 8KB SRAM, 36 I/O, 48-VFQFN exposed pad, -40°C to 105°C operating temp, 3.0–3.6V supply.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Speed":"50MHz","title":"LM3S800-EGZ50-C2","Series":"Stellaris® ARM® Cortex®-M3S 800","Package":"Tray","RAM Size":"8K x 8","Core Size":"32-Bit Single-Core","Peripherals":"Brown-out Detect/Reset, POR, PWM, WDT","Connectivity":"I²C, Microwire, SPI, SSI, UART/USART","Mounting Type":"Surface Mount","Number of I/O":"36","Core Processor":"ARM® Cortex®-M3","Package / Case":"48-VFQFN Exposed Pad","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"LM3S800","Program Memory Size":"64KB (64K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~105°C(TA)","Supplier Device Package":"48-VQFN (7x7)","Voltage - Supply (Vcc/Vdd)":"3V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/2dec183ffab729fb49075df0afd6d4ba.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/LM3S800-EGZ50-C2/alternatives.json"},"ai":{"faq":[{"question":"Can I hot-swap the LM3S800-EGZ50-C2 in a socket for a line-down repair?","answer":"The brown-out detect/reset and POR peripherals are present on-chip, but hot-swapping a QFN device in a production socket introduces mechanical and thermal risk for the package and solder joint. Controlled power-down before removal is the safer practice for field-service replacement of a 48-VFQFN part. Confirm socket type and board layout against the original HMI gateway documentation before attempting in-circuit replacement."},{"question":"What is the lead time and MOQ for a 25-unit panel-build run?","answer":"The EOL-hot lifecycle flag means lead time and minimum order quantity are quoted per RFQ — they are not fixed catalog parameters at this stage. Tray packaging is the standard pack form for this part; reel quantity and MOQ depend on current distributor allocation. Submit an RFQ with your 25-unit quantity and the EOL notification timeline from TI's Product Notification Center so sourcing can match available stock to your build schedule."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/LM3S800-EGZ50-C2","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/LM3S800-EGZ50-C2 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}