{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"LM3S615-EGZ50-C2T","brand":"Texas Instruments","brandSlug":"texas-instruments","productSlug":"LM3S615-EGZ50-C2T","canonicalUrl":"https://icboms.com/texas-instruments/LM3S615-EGZ50-C2T","factsUrl":"https://icboms.com/api/mcp/products/LM3S615-EGZ50-C2T","rawCanonicalId":null},"summary":{"shortDescription":"Stellaris LM3S615-EGZ50-C2T ARM Cortex-M3 MCU, 50MHz, 32KB flash, 8KB RAM, 34 GPIO, I²C/SPI/SSI/UART, 2×10-bit ADC, internal oscillator, 3.3V supply, -40°C to 105°C, 48-VFQFN exposed pad in tape & reel.","salesMarkdown":null,"metaTitle":"LM3S615-EGZ50-C2T Stellaris 50MHz ARM Cortex-M3 MCU, 32KB Flash","metaDescription":"Stellaris ARM Cortex-M3S 600 MCU at 50MHz with 32KB flash, 8KB RAM, 34 I/O, 2x10-bit ADC, -40°C to 105°C operating range, 48-VFQFN package.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Microcontrollers & Processors (MCU / MPU / DSP)"],"specifications":{"Speed":"50MHz","title":"LM3S615-EGZ50-C2T","Series":"Stellaris® ARM® Cortex®-M3S 600","Package":"Tape & Reel (TR)","RAM Size":"8K x 8","Core Size":"32-Bit Single-Core","Peripherals":"Brown-out Detect/Reset, POR, PWM, WDT","Connectivity":"I²C, Microwire, SPI, SSI, UART/USART","Mounting Type":"Surface Mount","Number of I/O":"34","Core Processor":"ARM® Cortex®-M3","Package / Case":"48-VFQFN Exposed Pad","Data Converters":"A/D 2x10b","Oscillator Type":"Internal","lifecycle_stage":"eol_hot","Base Product Number":"LM3S615","Program Memory Size":"32KB (32K x 8)","Program Memory Type":"FLASH","Operating Temperature":"-40°C~105°C(TA)","Supplier Device Package":"48-VQFN (7x7)","Voltage - Supply (Vcc/Vdd)":"3V ~ 3.6V"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/3bfe055e3a8164f3ed23138807851b33.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/LM3S615-EGZ50-C2T/alternatives.json"},"ai":{"faq":[{"question":"Is the 48-VFQFN exposed pad package suitable for reflow rework without delaminating the pad?","answer":"The exposed pad is the primary thermal path and must be soldered to the board pad with thermal vias for rated thermal performance. On rework, prebake before reflow is required to avoid pad delamination — a standard hot-air station approach without prebake is a known failure mode on QFN packages of this generation."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/texas-instruments/LM3S615-EGZ50-C2T","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/texas-instruments/LM3S615-EGZ50-C2T when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}