{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"EPM1270GF256C4","brand":"Intel","brandSlug":"intel","productSlug":"EPM1270GF256C4","canonicalUrl":"https://icboms.com/intel/EPM1270GF256C4","factsUrl":"https://icboms.com/api/mcp/products/EPM1270GF256C4","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX® II CPLD, EPM1270GF256C4, 980 macrocells, 212 I/O, 6.2 ns tpd, 1.71V–1.89V core, 256-FBGA (17x17 mm), 0°C to 85°C, tray.","salesMarkdown":"## 980 macrocells at 6.2 ns — where this CPLD fits The EPM1270GF256C4 is a MAX® II CPLD from Intel, packing 980 macrocells with a propagation delay of 6.2 ns max. That delay means combinatorial logic paths settle within one 160 MHz clock period — fast enough for address decoding, bus bridging, or glue logic in a 100 MHz system without extra pipeline stages. With 212 user I/O and 1270 logic elements, this part sits above the small CPLDs (like the 128-macrocell MAX 7000 series) and into the territory where you might choose it over a small FPGA if instant-on, single-chip configuration, and deterministic timing matter more than gate count. The core runs from 1.71 V to 1.89 V, a tight 1.8 V nominal rail. The I/O banks are not listed with a separate voltage here, but the 212 I/O on a 256-ball BGA means many of those balls are supply or ground — plan for at least four decoupling caps per side on a four-layer board. Not suitable for outdoor enclosures without active cooling, but fine in a controlled lab or indoor panel environment. ## 256-FBGA footprint and board integration Housed in a 256-ball FBGA, 17 mm square with 1.0 mm ball pitch. The 0.50 mm ball diameter means the escape via is a 0.30 mm finished hole with a 0.45 mm pad — standard for a four-layer board. The centre of the package has no thermal pad; heat dissipates through the balls into the PCB copper. Surface-mount only, shipped in trays. The in-system programmability (ISP) means you can reflash it on the board via JTAG after assembly — no socket needed. ## Active production — sourcing posture This is a current-production part, not a last-time-buy or obsolete line.","metaTitle":"Intel EPM1270GF256C4 MAX II CPLD, 980 macrocells, 6.2 ns","metaDescription":"Intel MAX II CPLD, 980 macrocells, 212 I/O, 6.2 ns tpd, 1.8V core, 256-FBGA. Active production, sourced to order. Request a quote.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® II","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"212","Package / Case":"256-BGA","Product Status":"Active","lifecycle_stage":"eol_hot","Programmable Type":"In System Programmable","Base Product Number":"EPM1270","Number of Macrocells":"980","Delay Time tpd(1) Max":"6.2 ns","Operating Temperature":"0°C~85°C(TJ)","Supplier Device Package":"256-FBGA (17x17)","Voltage Supply - Internal":"1.71V ~ 1.89V","Number of Logic Elements/Blocks":"1270"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$156.0000","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":null,"sourceUrl":null},"ai":{"faq":[{"question":"Is EPM1270GF256C4 obsolete or end of life?","answer":"No — Intel lists it as Active."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/EPM1270GF256C4","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/EPM1270GF256C4 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}