{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"EPM1270GF256C3","brand":"Intel","brandSlug":"intel","productSlug":"EPM1270GF256C3","canonicalUrl":"https://icboms.com/intel/EPM1270GF256C3","factsUrl":"https://icboms.com/api/mcp/products/EPM1270GF256C3","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX II CPLD, EPM1270GF256C3, 980 macrocells, 212 I/O, 6.2 ns tpd, 1.8 V core, 256-FBGA, tray.","salesMarkdown":"## Logic capacity and speed grade for glue-logic consolidation The Intel EPM1270GF256C3 is a MAX II CPLD with 980 macrocells and 1270 logic elements — enough to absorb a handful of 74-series glue-logic devices or a small state machine into a single programmable part. The 6.2 ns tpd(1) max propagation delay means combinatorial paths settle within one clock cycle at moderate speeds, suitable for bus decoding, address mapping, or control logic in a 50–100 MHz system. The 212 user I/O pins, spread across a 256-ball FBGA (17x17 mm), give plenty of headroom for connecting to a wide memory bus, multiple peripheral interfaces, or a large number of panel indicators and pushbuttons. The 1.71 V to 1.89 V core supply keeps dynamic power low, and the in-system programmable (ISP) flash allows reconfiguration without removing the part from the board. ## Package and board integration for the 256-FBGA The 256-ball FBGA (17x17 mm) with 1.0 mm ball pitch is a hand-solderable challenge — a rework station with a hot-air nozzle matched to the package footprint and a stencil for the BGA land pattern are the practical minimum. The 0°C to 85°C junction temperature range covers most indoor and telecom equipment environments but not extended industrial or automotive under-hood duty. The tray packaging means the parts arrive in a rigid carrier, not tape-and-reel — fine for prototype builds and low-volume production but worth noting for automated pick-and-place lines that expect embossed tape. The 256-FBGA has no exposed thermal pad; heat removal relies on the PCB copper planes under the BGA balls and any airflow across the package.","metaTitle":"Intel EPM1270GF256C3 MAX II CPLD, 980 macrocells, 212 I/O","metaDescription":"Intel EPM1270GF256C3 MAX II CPLD with 980 macrocells, 212 I/O, 6.2 ns tpd. Active production, 256-FBGA. Sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® II","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"212","Package / Case":"256-BGA","Product Status":"Active","lifecycle_stage":"eol_hot","Programmable Type":"In System Programmable","Base Product Number":"EPM1270","Number of Macrocells":"980","Delay Time tpd(1) Max":"6.2 ns","Operating Temperature":"0°C~85°C(TJ)","Supplier Device Package":"256-FBGA (17x17)","Voltage Supply - Internal":"1.71V ~ 1.89V","Number of Logic Elements/Blocks":"1270"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$156.0000","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":null,"sourceUrl":null},"ai":{"faq":[{"question":"What is the equivalent of EPM1270GF256C3?","answer":"The EPM1270GF256C3 is a MAX II device; the older MAX 7000 series parts (such as EPM7128BFC256-7) share the CPLD class but differ in architecture, macrocell count (128 vs 980), I/O count (100 vs 212), and package options — they are not drop-in replacements."},{"question":"Does EPM1270GF256C3 have JTAG support?","answer":"The EPM1270GF256C3 is in-system programmable (ISP), which implies JTAG-based programming via the IEEE 1149.1 interface. The MAX II family uses a 4-pin JTAG port (TCK, TMS, TDI, TDO) for configuration and boundary-scan testing."},{"question":"What is the footprint of EPM1270GF256C3?","answer":"The package is a 256-ball FBGA with a 17x17 mm body. The ball pitch is 1.0 mm, arranged in a 16x16 ball grid array. The supplier device package is 256-FBGA (17x17)."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/EPM1270GF256C3","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/EPM1270GF256C3 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}