{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"EP4CE75F23C9LN","brand":"Intel","brandSlug":"intel","productSlug":"EP4CE75F23C9LN","canonicalUrl":"https://icboms.com/intel/EP4CE75F23C9LN","factsUrl":"https://icboms.com/api/mcp/products/EP4CE75F23C9LN","rawCanonicalId":null},"summary":{"shortDescription":"Intel Cyclone® IV E FPGA, EP4CE75F23C9LN, 75408 logic elements, 292 I/O, 2810880 bits RAM, 484-BGA, 0°C~85°C, tray.","salesMarkdown":"## Cyclone IV E FPGA — 75K LE density in a 484-ball BGA The Intel EP4CE75F23C9LN is a Cyclone® IV E FPGA with 75408 logic elements, 4713 LAB/CLB blocks, and 2810880 bits of embedded RAM in a 484-ball FBGA package. With 292 user I/O and a core supply of 0.97 V to 1.03 V, it targets cost-sensitive, high-volume applications. ## What the key ratings mean for the BOM The 75408 logic elements set the gate-count ceiling. The 292 I/O in a 484-BGA (23x23 mm) gives enough pins for a memory bus or parallel LCD controller. The 2810880 bits of block RAM handle moderate FIFO depths. ## Package and mounting — 484-FBGA, 23x23 mm, surface-mount The 484-ball FBGA (23x23 mm) is a mid-density BGA. The surface-mount package requires a standard reflow profile; no underfill is mandated for commercial-temperature operation. ## Provenance and marking — what to check on receipt The top mark on the EP4CE75F23C9LN reads the base product number EP4CE75, the speed grade (C9), the temperature code (LN for lead-free, commercial), and a date-code lot trace number. The 484-BGA package has a chamfered corner on ball A1.","metaTitle":"Intel Cyclone IV E EP4CE75F23C9LN FPGA, 75408 LEs, 292 I/O","metaDescription":"Intel Cyclone IV E FPGA with 75408 logic elements, 292 user I/O, 2810880 bits RAM. Active production, 0°C to 85°C commercial temp. Sourced to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"Cyclone® IV E","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"292","Package / Case":"484-BGA","Product Status":"Active","Total RAM Bits":"2810880","lifecycle_stage":"eol_hot","Voltage - Supply":"0.97V ~ 1.03V","Base Product Number":"EP4CE75","Number of LABs/CLBs":"4713","Operating Temperature":"0°C~85°C(TJ)","Supplier Device Package":"484-FBGA (23x23)","Number of Logic Elements/Cells":"75408"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$69.0000","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/23f940096df14882a869c89fec8641ad.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the difference between EP4CE75F23C9LN and EP4CE75F23I7LN?","answer":"The C9LN variant is the commercial-temperature grade (0°C to 85°C junction), while the I7LN is the industrial-temperature grade (-40°C to 100°C junction). Both share the same 484-FBGA footprint, same logic density, and same bitstream compatibility. The I7LN is the correct choice for outdoor or factory-floor environments; the C9LN is for indoor, conditioned spaces."},{"question":"Is EP4CE75F23C9LN RoHS compliant?","answer":"The 'LN' suffix in the order code indicates lead-free (RoHS-compliant) finish. This variant uses a lead-free solder ball composition and is compatible with RoHS assembly processes."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/EP4CE75F23C9LN","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/EP4CE75F23C9LN when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}