{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"EP4CE55F29C8","brand":"Intel","brandSlug":"intel","productSlug":"EP4CE55F29C8","canonicalUrl":"https://icboms.com/intel/EP4CE55F29C8","factsUrl":"https://icboms.com/api/mcp/products/EP4CE55F29C8","rawCanonicalId":null},"summary":{"shortDescription":"Intel Cyclone® IV E FPGA, EP4CE55F29C8, 55856 logic elements, 2396160 RAM bits, 374 I/O, 780-BGA (29x29 mm), 1.15V~1.25V core, 0°C~85°C.","salesMarkdown":"## Active production — no shortage signal on this Cyclone IV E density point The EP4CE55F29C8: For the shortage-desk buyer, this means the part is still in the franchised channel and not subject to the allocation windows that hit older 90-nm families. The 55,856 logic elements and 2,396,160 RAM bits place it in the mid-range of the Cyclone IV E family — a density tier that typically sees stable lead times unless a concurrent FPGA shortage cycle tightens supply. ## 55,856 LEs and 2,396,160 RAM bits — the gate-count and memory fit The 55,856 logic elements (3491 LABs/CLBs) define the usable gate budget for the design. For a firmware-bringup engineer, this is the resource that constrains the RTL — a 50,000-LE image fits with margin; a 70,000-LE image does not. The 2,396,160 total RAM bits (about 2.3 Mbit) are embedded block RAM, not external memory. Enough for moderate FIFO buffers or a small frame buffer in a display or communication pipeline, but designs needing larger data storage will budget an external SDRAM or SRAM on the board. ## 374 I/O in a 780-BGA — the pin-limited resource 374 user I/O are available in the 780-ball BGA (29x29 mm, 1.0 mm pitch). For the PCB layout engineer, this is a 4-layer board minimum for fan-out — the inner rows of the BGA require via-in-pad or microvias on a high-density design. An enclosure with forced airflow or a heatsink is expected if the device dissipates more than a few watts at the high end of the range.","metaTitle":"Intel EP4CE55F29C8 Cyclone IV E FPGA, 55856 LE, 374 I/O","metaDescription":"Intel Cyclone IV E FPGA EP4CE55F29C8, 55856 logic elements, 2396160 RAM bits, 374 I/O, 780-BGA. Active production — sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"Cyclone® IV E","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"374","Package / Case":"780-BGA","Product Status":"Active","Total RAM Bits":"2396160","lifecycle_stage":"eol_hot","Voltage - Supply":"1.15V ~ 1.25V","Base Product Number":"EP4CE55","Number of LABs/CLBs":"3491","Operating Temperature":"0°C~85°C(TJ)","Supplier Device Package":"780-FBGA (29x29)","Number of Logic Elements/Cells":"55856"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$69.0000","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/23f940096df14882a869c89fec8641ad.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the replacement for EP4CE55F29C8?","answer":"Intel lists no official successor for this part. The Cyclone 10 LP family (e.g., 10CL055YF484C6G) offers the same 55,856 logic elements and 2,396,160 RAM bits in a different package (484-FBGA vs 780-BGA), so a board spin is required to migrate."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/EP4CE55F29C8","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/EP4CE55F29C8 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}