{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"EP4CE115F23I8LN","brand":"Intel","brandSlug":"intel","productSlug":"EP4CE115F23I8LN","canonicalUrl":"https://icboms.com/intel/EP4CE115F23I8LN","factsUrl":"https://icboms.com/api/mcp/products/EP4CE115F23I8LN","rawCanonicalId":null},"summary":{"shortDescription":"Intel Cyclone® IV E FPGA, EP4CE115F23I8LN, 114480 logic elements, 280 I/O, 3981312 bits RAM, 484-BGA, -40°C to 100°C, 1.0V core.","salesMarkdown":"The EP4CE115F23I8LN packs 114480 logic elements (LEs) in a Cyclone IV E fabric, which is the 60 nm, low-power, cost-optimized tier of Intel's FPGA lineup. That LE count puts it in the upper-midrange of the family — enough to hold a soft-core processor (like a Nios II), a few DSP datapaths, and a modest peripheral bus without running into routability issues. Each LE contains a four-input LUT, a register, and carry logic, so the 114480 figure is the raw logic resource before any DSP or memory blocks. For a typical glue-logic or interface design, you'll consume about 60-70% of the LEs before the place-and-route tool starts struggling to close timing at 200+ MHz. ## 280 I/O in a 484-ball BGA — routing reality 280 user I/O escape from a 484-ball BGA (23 mm × 23 mm body, 1.0 mm ball pitch) means roughly 58% of the balls are signal pins. The remaining balls are power and ground — critical for signal integrity at the 1.0 V core voltage. You'll need at least a 6-layer PCB to fan out all 280 I/O without resorting to microvias; an 8-layer stack-up gives comfortable room for differential pairs and controlled-impedance traces. The I/O banks run at 1.2 V to 3.3 V, so the 280 pins can interface directly with common memory (DDR2, DDR3), parallel ADCs, or LVDS transceivers. No external level shifters needed for most 3.3 V logic families. This is the standard grade for factory automation, outdoor telecom, and automotive infotainment — environments where the ambient air can hit 85°C and the FPGA's own power dissipation adds another 15°C on top. At 100°C TJ, the static power (leakage) roughly doubles compared to 85°C, so your thermal solution needs to keep the junction below that ceiling. The 484-FBGA package's exposed pad helps — a solid thermal via array under the die area drops the θJA by about 30% versus a standard BGA.","metaTitle":"Intel EP4CE115F23I8LN Cyclone IV E FPGA, 114480 LEs, 280 I/O","metaDescription":"Intel EP4CE115F23I8LN Cyclone IV E FPGA, 114480 logic elements, 280 I/O, 484-BGA, -40°C to 100°C. Active production, sourced per RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"Cyclone® IV E","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"280","Package / Case":"484-BGA","Product Status":"Active","Total RAM Bits":"3981312","lifecycle_stage":"eol_hot","Voltage - Supply":"0.97V ~ 1.03V","Base Product Number":"EP4CE115","Number of LABs/CLBs":"7155","Operating Temperature":"-40°C~100°C(TJ)","Supplier Device Package":"484-FBGA (23x23)","Number of Logic Elements/Cells":"114480"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$69.0000","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/23f940096df14882a869c89fec8641ad.pdf","sourceUrl":null},"ai":{"faq":[{"question":"Can EP4CE115F23I8LN be replaced by EP4CE115F23C8?","answer":"The two parts are otherwise identical in logic density, I/O count, and package. If your application requires operation below 0°C or above 85°C ambient, only the 'I' variant will work."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/EP4CE115F23I8LN","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/EP4CE115F23I8LN when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}