{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"CY7C2263XV18-600BZXC","brand":"Cypress Semiconductor Corp","brandSlug":"cypress-semiconductor-corp","productSlug":"CY7C2263XV18-600BZXC","canonicalUrl":"https://icboms.com/cypress-semiconductor-corp/CY7C2263XV18-600BZXC","factsUrl":"https://icboms.com/api/mcp/products/CY7C2263XV18-600BZXC","rawCanonicalId":null},"summary":{"shortDescription":"Infineon (Cypress) CY7C2263XV18-600BZXC, 36Mbit synchronous QDR II+ SRAM, 600 MHz, 1.7–1.9 V, 165-FBGA (13×15), 2M × 18, surface mount, 0°C to 70°C.","salesMarkdown":"The QDR II+ interface eliminates bus-turnaround dead cycles by dedicating separate read and write ports, so back-to-back transactions at full clock rate are possible — critical for high-throughput networking buffers, line cards, and DSP pipelines that cannot tolerate wait states. Organized as 2M x 18, it matches 18-bit-wide data paths common in switch fabrics and FFT engines. That means indoor, climate-controlled equipment: central-office telecom, data-center switches, test-and-measurement racks. Not suited for a motor-drive cabinet or an outdoor base station without active cooling. If your BOM calls for industrial or automotive temperature, this is the wrong part. 165-ball FBGA, 13 x 15 mm body. Bulk packaging (trays). Listed as Active.","metaTitle":"Infineon CY7C2263XV18-600BZXC 36Mbit QDR II+ SRAM, 600 MHz","metaDescription":"Active 36Mbit synchronous QDR II+ SRAM from Infineon (Cypress). 600 MHz clock, 2M x 18 organization, 1.7–1.9 V supply, 165-FBGA (13x15), 0°C–70°C. Available to order; request a quo","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"title":"CY7C2263XV18-600BZXC","Package":"Bulk","Technology":"SRAM - Synchronous, QDR II+","Memory Size":"36Mbit","Memory Type":"Volatile","description":"IC SRAM 36MBIT PAR 165FBGA","Memory Format":"SRAM","Mounting Type":"Surface Mount","Package / Case":"165-LBGA","Clock Frequency":"600 MHz","Memory Interface":"Parallel","Voltage - Supply":"1.7V ~ 1.9V","Base Product Number":"CY7C2263","Memory Organization":"2M x 18","Operating Temperature":"0°C ~ 70°C (TA)","Supplier Device Package":"165-FBGA (13x15)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$110.9200","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/f51ca91a1ebd4eb3be938d041bd3c775.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/CY7C2263XV18-600BZXC/alternatives.json"},"ai":{"faq":[{"question":"Will CY7C2263XV18-600BZXC drop into a board designed for CY7C2268XV18-600BZXC without rewiring?","answer":"Yes — both share the same 165-FBGA footprint, 2M x 18 organization, 1.7–1.9 V supply, and commercial temperature range. The only difference is the clock speed: 600 MHz on this part versus 633 MHz on the CY7C2268XV18-633BZXC. No layout change is needed."},{"question":"What is the package type for CY7C2263XV18-600BZXC?","answer":"It ships in Bulk (tray) packaging, in a 165-ball FBGA measuring 13 x 15 mm."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/cypress-semiconductor-corp/CY7C2263XV18-600BZXC","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/cypress-semiconductor-corp/CY7C2263XV18-600BZXC when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-16T10:39:33.080Z","lastPublished":"2026-07-16T10:39:33.080Z","indexable":true}}