{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"CY7C1911KV18-300BZCT","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"CY7C1911KV18-300BZCT","canonicalUrl":"https://icboms.com/infineon/CY7C1911KV18-300BZCT","factsUrl":"https://icboms.com/api/mcp/products/CY7C1911KV18-300BZCT","rawCanonicalId":null},"summary":{"shortDescription":"Cypress CY7C1911KV18-300BZCT, 18Mbit QDR II synchronous SRAM, 300 MHz clock, parallel interface, 1.7V–1.9V supply, 165-FBGA (13x15), 0°C to 70°C.","salesMarkdown":"## QDR II SRAM — what this chip does on the board At a 300 MHz clock, each port delivers 600 MHz effective data rate, which is what line-card and switch-fabric designs need for back-to-back read-write throughput without stalling the pipeline. Organised as 2M x 9 (two 1M x 9 ports), it uses a parallel interface and runs from a 1.7V to 1.9V core supply. That puts it squarely in indoor telecom racks, test equipment, and enterprise networking gear — not in outdoor or under-hood environments where the ambient exceeds 70°C. ## Obsolete — the sourcing reality for this BGA memory A pin-compatible QDR II SRAM (e.g. a different speed bin or a later density) would require a board respin or at minimum a timing re-characterisation; there is no drop-in replacement with the same footprint and timing that Cypress certifies as a direct swap. At 300 MHz, the QDR II interface delivers a 3.33 ns clock period. The read and write data buses are source-synchronous with echo clocks, so the timing budget is tight: the board trace length matching between the SRAM and the controller (FPGA or ASIC) needs to stay within roughly ±0.5 inches on a typical FR4 stack-up to avoid setup/hold violations. If you are replacing a failed unit on an existing board, the original layout already accounts for this; a substitute with a different package or speed grade will shift the flight times and likely break the margin. ## 165-FBGA — rework and handling notes The 165-ball FBGA (13x15 mm, 1 mm ball pitch) is a standard BGA footprint for this density class. Reballing is possible with a stencil and the right solder sphere diameter, but the fine pitch means the hot-air profile must be tight — too much top-side heat and the package cracks; too little and the centre balls don't collapse. The tape-and-reel shipping format suggests this was originally intended for high-volume pick-and-place, but for replacement quantities you will typically receive the parts in cut tape or trays from the surplus channel.","metaTitle":"Cypress CY7C1911KV18-300BZCT 18Mbit QDR II SRAM, 300 MHz","metaDescription":"Cypress CY7C1911KV18-300BZCT 18Mbit QDR II synchronous SRAM in 165-FBGA, 300 MHz clock, 1.7V–1.9V supply.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Obsolete","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"Mfr":"Infineon Technologies","Series":"-","Package":"Tape & Reel (TR)","Technology":"SRAM - Synchronous, QDR II","Memory Size":"18Mbit","Memory Type":"Volatile","Memory Format":"SRAM","Mounting Type":"Surface Mount","Package / Case":"165-LBGA","Product Status":"Obsolete","Clock Frequency":"300 MHz","lifecycle_stage":"eol_hot","Memory Interface":"Parallel","Voltage - Supply":"1.7V ~ 1.9V","Base Product Number":"CY7C1911","Memory Organization":"2M x 9","Operating Temperature":"0°C ~ 70°C (TA)","Supplier Device Package":"165-FBGA (13x15)","Write Cycle Time - Word, Page":"-"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/66c682634920522619c3dfcc3a818445.pdf","sourceUrl":null},"ai":{"faq":[{"question":"Is CY7C1911KV18-300BZCT obsolete?","answer":"Yes, the CY7C1911KV18-300BZCT is listed as Obsolete. Cypress (Infineon) no longer produces this exact part. The only source today is the independent surplus and new-old-stock market, where availability and pricing vary by lot."},{"question":"Where can I buy CY7C1911KV18-300BZCT available via RFQ confirmation?","answer":"As an obsolete part, CY7C1911KV18-300BZCT is not stocked in factory or authorised-distributor channels. Submit an RFQ through this listing; we will check our network of surplus and NOS suppliers and return a quote with current availability and pricing."},{"question":"What is the difference between CY7C1911KV18-300BZCT and CY7C1911KV18-300BZC?","answer":"The difference is the shipping medium. CY7C1911KV18-300BZCT is the Tape & Reel (TR) variant intended for automated pick-and-place assembly. CY7C1911KV18-300BZC is the tray (or bulk) variant. The silicon, package, and electrical specifications are identical. If you are populating a board by hand or in low volume, the tray variant may be more convenient; for high-volume SMT, the tape-and-reel version feeds the feeder directly."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/CY7C1911KV18-300BZCT","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/CY7C1911KV18-300BZCT when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}