{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"CY7C1512KV18-300BZXC","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"CY7C1512KV18-300BZXC","canonicalUrl":"https://icboms.com/infineon/CY7C1512KV18-300BZXC","factsUrl":"https://icboms.com/api/mcp/products/CY7C1512KV18-300BZXC","rawCanonicalId":null},"summary":{"shortDescription":"Infineon Technologies CY7C1512KV18-300BZXC QDR II SRAM, 72 Mbit (4M x 18), 300 MHz clock, 1.7V–1.9V supply, 165-FBGA (13x15 mm), tray.","salesMarkdown":"## 72 Mbit QDR II at 300 MHz — the throughput anchor The CY7C1512KV18-300BZXC is a 72 Mbit Quad Data Rate (QDR) II synchronous SRAM organized as 4M x 18 bits. The 300 MHz clock rate delivers four data transfers per cycle — two on each clock edge — for a peak read bandwidth of 2.7 Gbytes/s on the 18-bit bus. QDR II architecture separates read and write data ports, eliminating bus-turnaround dead cycles that plague common-I/O SRAMs. The parallel memory interface keeps the data path deterministic for pipelined logic. Operates from a 1.7V to 1.9V core supply — the 1.8V nominal rail is standard for this density class. The 165-FBGA package (13x15 mm body) uses a 1.0 mm ball pitch. The layout engineer should budget four inner signal layers for fan-out; the core supply decoupling caps sit directly under the BGA on the opposite side of the board. ## Board integration and delivery Supplied in tray format — the standard carrier for BGA devices in volume assembly. The 165-ball FBGA footprint is JEDEC-registered; the solder-ball composition is RoHS-compatible per Infineon's standard material declaration.","metaTitle":"Infineon CY7C1512KV18-300BZXC QDR II SRAM, 72 Mbit, 300 MHz","metaDescription":"Infineon CY7C1512KV18-300BZXC QDR II SRAM, 72 Mbit (4M x 18), 300 MHz clock, 1.7V–1.9V, 165-FBGA, active production. Sourced to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"Mfr":"Infineon Technologies","Series":"-","Package":"Tray","Technology":"SRAM - Synchronous, QDR II","Memory Size":"72Mbit","Memory Type":"Volatile","Memory Format":"SRAM","Mounting Type":"Surface Mount","Package / Case":"165-LBGA","Product Status":"Active","Clock Frequency":"300 MHz","lifecycle_stage":"eol_hot","Memory Interface":"Parallel","Voltage - Supply":"1.7V ~ 1.9V","Base Product Number":"CY7C1512","Memory Organization":"4M x 18","Operating Temperature":"0°C~70°C(TA)","Supplier Device Package":"165-FBGA (13x15)","Write Cycle Time - Word, Page":"-"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$180.1100","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/d01d52715057689be6bea1e1619daec3.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/CY7C1512KV18-300BZXC/alternatives.json"},"ai":{"faq":[{"question":"What is the memory organization and interface of this SRAM?","answer":"The CY7C1512KV18-300BZXC is organized as 4M x 18 bits (72 Mbit total) with a parallel QDR II interface. The 300 MHz clock rate enables four data transfers per cycle on the 18-bit data bus."},{"question":"What package does the CY7C1512KV18-300BZXC use?","answer":"It comes in a 165-ball FBGA package (13x15 mm body, 1.0 mm ball pitch), supplied in tray format for surface-mount assembly."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/CY7C1512KV18-300BZXC","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/CY7C1512KV18-300BZXC when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}