{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"CY7C1170KV18-450BZXC","brand":"Infineon Technologies","brandSlug":"infineon","productSlug":"CY7C1170KV18-450BZXC","canonicalUrl":"https://icboms.com/infineon/CY7C1170KV18-450BZXC","factsUrl":"https://icboms.com/api/mcp/products/CY7C1170KV18-450BZXC","rawCanonicalId":null},"summary":{"shortDescription":"Cypress CY7C1170KV18-450BZXC, 18Mbit Synchronous DDR II+ SRAM, 512K x 36 organization, 450 MHz clock frequency, Parallel interface, 1.7V-1.9V supply, 165-LBGA, Commercial temperature.","salesMarkdown":"## 18 Mbit DDR II+ SRAM at 450 MHz — bus bandwidth for high-throughput buffers It clocks at 450 MHz over a parallel interface, delivering back-to-back read/write throughput without the dead cycles that plague conventional burst SRAM. ## 450 MHz clock — timing closure and bus margin At 450 MHz the clock period is roughly 2.22 ns. The DDR II+ interface transfers data on both edges, so the effective data rate per pin is 900 MT/s. That puts tight demands on the controller's output hold time and the board's trace-length matching. The 36-bit data bus at this speed typically needs a source-synchronous clocking scheme with per-byte DQS strobes — the controller must support that protocol, not just a generic synchronous SRAM interface. If your FPGA or ASIC memory controller is rated for 400 MHz or lower, this part is a speed-grade mismatch; budget the timing analysis before committing the layout. The 165-ball FBGA (13 x 15 mm) uses a 1.0 mm ball pitch. That is a standard BGA footprint that four-layer PCBs can route with via-in-pad or dogbone fanout. The supplier device code 165-FBGA (13x15) tells you the exact ball map — order the Cypress package drawing before laying out the escape pattern. No heatsink is required at commercial temperature and 1.9 V max supply; the package's thermal pad (if exposed) should be stitched to a ground plane with at least nine vias for adequate heat transfer. It belongs in indoor equipment — servers, switches, base stations, test gear — not in an engine bay, rooftop enclosure, or unheated warehouse. If your system sees -20°C startup or 85°C internal air, step up to the industrial-temperature variant in this family (BZ suffix vs. BZ).","metaTitle":"Cypress CY7C1170KV18-450BZXC 18Mbit DDR II+ SRAM, 450 MHz","metaDescription":"Cypress CY7C1170KV18-450BZXC 18Mbit (512K x 36) synchronous DDR II+ SRAM in 165-FBGA. 450 MHz clock, 1.7V-1.9V supply, commercial temp.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Memory (DRAM / SRAM / Flash / EEPROM)"],"specifications":{"Mfr":"Infineon Technologies","Series":"-","Package":"Tray","Technology":"SRAM - Synchronous, DDR II+","Memory Size":"18Mbit","Memory Type":"Volatile","Memory Format":"SRAM","Mounting Type":"Surface Mount","Package / Case":"165-LBGA","Product Status":"Active","Clock Frequency":"450 MHz","lifecycle_stage":"eol_hot","Memory Interface":"Parallel","Voltage - Supply":"1.7V ~ 1.9V","Base Product Number":"CY7C1170","Memory Organization":"512K x 36","Operating Temperature":"0°C ~ 70°C (TA)","Supplier Device Package":"165-FBGA (13x15)","Write Cycle Time - Word, Page":"-"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$41.2200","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/41700fbc2e9665f5f5b934d93f510921.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/CY7C1170KV18-450BZXC/alternatives.json"},"ai":{"faq":[{"question":"What is the exact memory size of CY7C1170KV18-450BZXC?","answer":"The CY7C1170KV18-450BZXC is an 18 Mbit SRAM organized as 512K words by 36 bits."},{"question":"Is CY7C1170KV18-450BZXC a DDR II+ SRAM?","answer":"Yes, it is a synchronous DDR II+ SRAM — double data rate on both clock edges with a parallel interface."},{"question":"Does CY7C1170KV18-450BZXC require a heat sink?","answer":"At commercial temperature (0°C to 70°C) and 1.9 V maximum supply, the 165-FBGA package does not require a heatsink. Standard PCB thermal via stitching to a ground plane is sufficient."},{"question":"What are the alternative parts to CY7C1170KV18-450BZXC?","answer":"A lower-speed alternative is the CY7C1380KV33-167AXC, a 3.3 V 18 Mbit SRAM at 167 MHz. For a higher-density option, the CY7C1415KV18-300BZXC offers 36 Mbit at 300 MHz with the same 1.7 V supply and commercial temperature range. Neither is a pin-compatible drop-in — verify the package and voltage before substituting."},{"question":"Is CY7C1170KV18-450BZXC obsolete?","answer":"No."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/infineon/CY7C1170KV18-450BZXC","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/infineon/CY7C1170KV18-450BZXC when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}