{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"1N6677UR-1","brand":"Microchip Technology","brandSlug":"microchip","productSlug":"1N6677UR-1","canonicalUrl":"https://icboms.com/microchip/1N6677UR-1","factsUrl":"https://icboms.com/api/mcp/products/1N6677UR-1","rawCanonicalId":null},"summary":{"shortDescription":"Microchip Technology 1N6677UR-1 Schottky diode, 40 V reverse voltage, 200 mA average rectified current, 500 mV forward drop, DO-213AA surface-mount package, bulk.","salesMarkdown":"The 1N6677UR-1 is a 40 V Schottky rectifier rated for 200 mA continuous forward current in a DO-213AA surface-mount package. The 40 V reverse voltage ceiling suits it for clamping or rectifying on 12 V and 24 V rails where the peak transient stays under 30 V — the 10 V margin keeps the Schottky out of avalanche during inductive kickback. Forward drop is 500 mV maximum at 200 mA — the Schottky barrier delivers roughly half the Vf of a comparable PN-junction rectifier at this current, which directly reduces conduction loss in low-voltage supplies where every 100 mV of drop eats into the output headroom. ## Reverse leakage and junction temperature — the thermal trade-off Reverse leakage is specified at 5 µA maximum at 40 V. Schottky leakage doubles roughly every 10 °C above 25 °C junction — at 125 °C the leakage can approach several hundred microamps, which adds to the self-heating in a hot enclosure. The -65 to 125 °C junction range covers military temperature-grade environments, but the leakage at the hot end must be budgeted into the quiescent current of the powered circuit. Junction capacitance is 50 pF at 0 V bias, 1 MHz. In a 200 mA rectifier this capacitance is low enough that switching losses in a 100 kHz converter are negligible — the dominant loss term is the forward conduction drop, not the capacitive charge-discharge cycle. ## DO-213AA surface-mount — footprint and board integration The DO-213AA (also known as MELF-style) package is a cylindrical metal-electrode face-bonded component. The cathode band is marked on the body; the solder pads on the PCB must match the cylindrical contact area — a standard rectangular 0805 or 1206 footprint does not provide adequate solder fillet. The datasheet landing pattern calls for a concave pad profile that wraps around the barrel ends. Surface-mount assembly with DO-213AA requires careful pick-and-place nozzle selection — the cylindrical body can roll during placement if the vacuum pick-up is off-centre. Once reflowed, the joint reliability is comparable to a standard SMD package, but the visual inspection criterion differs because the solder fillet is at the barrel ends rather than under a flat lead. This means it remains eligible for new designs and is supported through the standard Microchip distribution channel.","metaTitle":"1N6677UR-1 Schottky Diode, 40 V, 200 mA, DO-213AA","metaDescription":"Microchip Technology 1N6677UR-1 Schottky rectifier, 40 V reverse, 200 mA average, 500 mV Vf, DO-213AA surface mount. Active production — quoted to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Discrete Semiconductors"],"specifications":{"Mfr":"Microchip Technology","Speed":"Small Signal =< 200mA (Io), Any Speed","Series":"-","Package":"Bulk","Diode Type":"Schottky","Mounting Type":"Surface Mount","Package / Case":"DO-213AA","Product Status":"Active","lifecycle_stage":"eol_hot","Base Product Number":"1N6677","Capacitance @ Vr, F":"50pF @ 0V, 1MHz","Supplier Device Package":"DO-213AA","Current - Reverse Leakage @ Vr":"5 µA @ 40 V","Voltage - DC Reverse (Vr) (Max)":"40 V","Current - Average Rectified (Io)":"200mA","Operating Temperature - Junction":"-65°C~125°C","Voltage - Forward (Vf) (Max) @ If":"500 mV @ 200 mA"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$8.9600","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/2233f165ed337e064463464439ff9335.pdf","sourceUrl":null,"alternativesUrl":"https://icboms.com/api/mcp/products/1N6677UR-1/alternatives.json"},"ai":{"faq":[{"question":"Who supplies 1N6677UR-1 and how is it quoted for volume purchases?","answer":"Microchip Technology is the brand manufacturer."},{"question":"What package does 1N6677UR-1 come in and how is it supplied?","answer":"It is supplied in a DO-213AA surface-mount package, in bulk (tube or tray) format — not tape-and-reel. The cylindrical MELF body requires a specific PCB footprint with concave solder pads at the barrel ends."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/microchip/1N6677UR-1","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/microchip/1N6677UR-1 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}