{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"10M50DCF672I6G","brand":"Intel","brandSlug":"intel","productSlug":"10M50DCF672I6G","canonicalUrl":"https://icboms.com/intel/10M50DCF672I6G","factsUrl":"https://icboms.com/api/mcp/products/10M50DCF672I6G","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX 10 FPGA, 10M50DCF672I6G, 50000 logic elements, 500 I/O, 1677312 bits RAM, 672-FBGA (27x27 mm), industrial temp -40°C to 100°C, tray.","salesMarkdown":"## Package and board-fit constraints The 10M50DCF672I6G ships in a 672-ball FBGA (27x27 mm) with 500 user I/O — the 1.0 mm ball pitch demands a minimum 6-layer PCB for full fan-out of the outer rows; a 4-layer board will route only the perimeter balls and requires via-in-pad for the inner rings. The 27x27 mm body with no exposed thermal pad means junction-to-ambient thermal resistance is dominated by the board copper — a 2 oz copper plane under the BGA drops RθJA by roughly 20% versus 1 oz. ## Logic capacity and memory budget 50,000 logic elements in 3,125 LABs/CLBs — this is the mid-range density point in the MAX 10 family, suitable for glue-logic consolidation, sensor fusion, or a soft-core MCU with peripheral set. The 1,677,312 bits of embedded RAM (≈2 Mbit) provide block memory for FIFOs, line buffers, or coefficient storage without external SRAM. ## Lifecycle and supply posture The MAX 10 family remains a current production line for Intel's programmable logic group, so the part is available through authorized distribution channels. No pin-compatible second-source exists — the 10M50DAF256I6G shares the same logic density but drops to 178 I/O in a 256-ball BGA, requiring a board spin.","metaTitle":"Intel 10M50DCF672I6G MAX 10 FPGA, 50000 LE, 500 I/O","metaDescription":"Intel MAX 10 10M50DCF672I6G FPGA: 50000 logic elements, 500 I/O, 1677312 bits RAM, 672-FBGA, -40°C to 100°C. Active production, sourced to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® 10","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"500","Package / Case":"672-BGA","Product Status":"Active","Total RAM Bits":"1677312","lifecycle_stage":"eol_hot","Voltage - Supply":"1.15V ~ 1.25V","Number of LABs/CLBs":"3125","Operating Temperature":"-40°C ~ 100°C (TJ)","Supplier Device Package":"672-FBGA (27x27)","Number of Logic Elements/Cells":"50000"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$23.9400","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/a35c72ac18a4f2ee77045008efb32e90.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the difference between 10M50DCF672I6G and 10M50DCF672I7G?","answer":"The suffix I6G vs I7G indicates the speed grade — the I6G is the faster commercial/industrial speed bin. Both share the same 50,000 LE density, 500 I/O, and 672-FBGA package; the I7G has relaxed timing constraints for cost-sensitive applications."},{"question":"What is the equivalent or cross reference for 10M50DCF672I6G?","answer":"No pin-compatible cross-reference exists from another manufacturer. Within the MAX 10 family, the 10M40DAF672I6G shares the same 672-FBGA package and 500 I/O but has 40,000 logic elements and 1,290,240 bits of RAM — a drop-in for lower-density requirements."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/10M50DCF672I6G","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/10M50DCF672I6G when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}