{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"10M50DAF256C6GES","brand":"Intel","brandSlug":"intel","productSlug":"10M50DAF256C6GES","canonicalUrl":"https://icboms.com/intel/10M50DAF256C6GES","factsUrl":"https://icboms.com/api/mcp/products/10M50DAF256C6GES","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX® 10 FPGA, 10M50DAF256C6GES, 50,000 logic elements, 178 I/O, 1677312 total RAM bits, 256-FBGA (17x17), 1.15V-1.25V core, 0°C to 85°C.","salesMarkdown":"## 50K LE MAX 10 in a 256-ball BGA The 10M50DAF256C6GES is an Intel MAX 10 FPGA packing 50,000 logic elements into a 256-ball FineLine BGA (17x17 mm). That logic density — 3125 LABs/CLBs — puts it in the middle of the MAX 10 lineup: enough fabric for a modest soft-core processor plus glue logic, but not so much that the 256-ball package becomes a routing bottleneck. The 178 user I/O break out to the outer two rows of the BGA, which means a 4-layer PCB with via-in-pad is the practical floor for fan-out. The 0.80 mm ball pitch is forgiving enough for a standard reflow profile, but the centre thermal pad needs a solid ground-plane stitch to keep the junction below 85 °C in a warm enclosure. ## On-chip memory and supply rails Total RAM bits come to 1,677,312 — roughly 2 Mbit of embedded memory distributed as M9K blocks. That is enough for a 256-deep FIFO on each of 64 channels or a moderate packet buffer without bolting on external SRAM. Operating temperature is 0 °C to 85 °C junction — the commercial-grade band. That suits indoor equipment, test gear, and telecom racks where the ambient stays below 70 °C. For engine-bay or outdoor cabinet duty, the industrial-grade sibling (10M50DAF256I6G) extends the range to 100 °C junction.","metaTitle":"Intel 10M50DAF256C6GES MAX 10 FPGA, 50K LE, 178 I/O","metaDescription":"Intel MAX 10 FPGA, 50K logic elements, 178 I/O, 1677312 RAM bits, 256-FBGA. Active production. Sourced to order against RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® 10","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"178","Package / Case":"256-LBGA","Total RAM Bits":"1677312","lifecycle_stage":"eol_hot","Voltage - Supply":"1.15V ~ 1.25V","Number of LABs/CLBs":"3125","Operating Temperature":"0°C ~ 85°C (TJ)","Supplier Device Package":"256-FBGA (17x17)","Number of Logic Elements/Cells":"50000"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":null,"stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/a35c72ac18a4f2ee77045008efb32e90.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the replacement for 10M50DAF256C6GES?","answer":"No replacement is required — the part is still active. If you need a functionally similar device with the same logic density and I/O count, the 10M50DCF256C7G shares the same 50,000 LE fabric and 178 I/O but comes in a different package variant (256-CSBGA vs 256-FBGA). The 10M40DCF256C8G drops to 40,000 logic elements with the same 178 I/O and is a cost-down option if the extra 10K LE are unused."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/10M50DAF256C6GES","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/10M50DAF256C6GES when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}