{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"10M25DCF484C7G","brand":"Intel","brandSlug":"intel","productSlug":"10M25DCF484C7G","canonicalUrl":"https://icboms.com/intel/10M25DCF484C7G","factsUrl":"https://icboms.com/api/mcp/products/10M25DCF484C7G","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX® 10 FPGA, 10M25DCF484C7G, 25000 logic elements, 360 I/O, 691200 RAM bits, 484-FBGA (23x23), Tray, 1.15V-1.25V core, 0°C to 85°C.","salesMarkdown":"The 10M25DCF484C7G is a MAX® 10 FPGA with 25000 logic elements and 360 user I/O in a 484-FBGA package (23x23 mm). The 25K LE count puts it in the mid-range of the MAX 10 family — enough for a modest sensor fusion engine, a display timing controller, or glue logic consolidation on a single-chip FPGA without external configuration memory (the MAX 10 integrates the flash). The 360 I/O in a 0.8 mm pitch BGA means the fan-out drives the layer count. A 4-layer board can break out the outer two rows; the inner balls need a 6-layer stack-up with blind vias or microvias. The core supply is a single 1.15V to 1.25V rail — one LDO or switching regulator covers it, no multi-rail sequencing. ## What the 691200 RAM bits and 1563 LABs buy you 691200 total RAM bits (about 86 KB) is enough for small FIFOs, line buffers for a VGA-resolution display, or coefficient storage for a digital filter. The 1563 LABs/CLBs each contain 10 logic elements, giving 15630 LEs in the logic-array fabric plus the routing and dedicated arithmetic blocks that the MAX 10 architecture adds on top of the LE count. The 0°C to 85°C commercial temperature grade means this part is for indoor equipment — networking gear, industrial HMIs, test equipment in a conditioned environment. Not for under-hood automotive or outdoor base stations without active cooling.","metaTitle":"10M25DCF484C7G MAX 10 FPGA, 25K LE, 360 I/O, 484-FBGA","metaDescription":"Intel MAX 10 FPGA 10M25DCF484C7G: 25000 logic elements, 360 I/O, 691200 RAM bits, 484-FBGA. Active lifecycle. Quoted to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® 10","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"360","Package / Case":"484-BGA","Product Status":"Active","Total RAM Bits":"691200","lifecycle_stage":"eol_hot","Voltage - Supply":"1.15V ~ 1.25V","Number of LABs/CLBs":"1563","Operating Temperature":"0°C ~ 85°C (TJ)","Supplier Device Package":"484-FBGA (23x23)","Number of Logic Elements/Cells":"25000"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$66.5205","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/a35c72ac18a4f2ee77045008efb32e90.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is the closest pin-compatible alternative to 10M25DCF484C7G in the MAX 10 family?","answer":"Within the same 484-FBGA package, the MAX 10 family offers higher-density siblings (e.g., 50K LE) and lower-density options (e.g., 16K LE) that share the same footprint and ball map. The pinout is consistent across the density range in the same package, so a board designed for the 10M25DCF484C7G can accept a drop-in replacement with a different LE count — provided the I/O count and RAM requirements still fit."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/10M25DCF484C7G","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/10M25DCF484C7G when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:49:49.435Z","lastPublished":"2026-08-11T15:49:49.435Z","indexable":true}}