{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"10M25DAF484I6G","brand":"Intel","brandSlug":"intel","productSlug":"10M25DAF484I6G","canonicalUrl":"https://icboms.com/intel/10M25DAF484I6G","factsUrl":"https://icboms.com/api/mcp/products/10M25DAF484I6G","rawCanonicalId":null},"summary":{"shortDescription":"Intel MAX® 10 FPGA, 10M25DAF484I6G, 25,000 logic elements, 360 I/O, 691,200 total RAM bits, 1.15V–1.25V supply, -40°C to 100°C junction, 484-BGA tray.","salesMarkdown":"## 25,000 logic elements — the gate-count budget Twenty-five thousand LEs (1563 LABs) is the mid-range density in the MAX 10 family. It fits glue-logic consolidation, a soft-core RISC-V or Nios II processor with a few peripherals, or a state-machine-heavy control sequencer. If your design is already mapped to a smaller MAX 10 and you are running out of registers or combinational logic, this part gives you headroom without moving to a different architecture or voltage rail. ## Industrial temperature range — what -40°C to 100°C junction means The junction temperature rating of -40°C to 100°C covers the industrial equipment standard. The -40°C cold start is fine for outdoor cabinets in temperate climates.","metaTitle":"Intel 10M25DAF484I6G MAX 10 FPGA, 25K LE, 360 I/O, -40 to 100°C","metaDescription":"Intel MAX 10 10M25DAF484I6G FPGA: 25,000 logic elements, 360 I/O, 691,200 bits RAM, 1.15-1.25V core, -40 to 100°C, 484-BGA. Active lifecycle, sourced to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["FPGA / CPLD & Programmable Logic"],"specifications":{"Mfr":"Intel","Series":"MAX® 10","Package":"Tray","Mounting Type":"Surface Mount","Number of I/O":"360","Package / Case":"484-BGA","Product Status":"Active","Total RAM Bits":"691200","lifecycle_stage":"eol_hot","Voltage - Supply":"1.15V ~ 1.25V","Number of LABs/CLBs":"1563","Operating Temperature":"-40°C ~ 100°C (TJ)","Supplier Device Package":"484-FBGA (23x23)","Number of Logic Elements/Cells":"25000"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$23.9400","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icboms.com/a35c72ac18a4f2ee77045008efb32e90.pdf","sourceUrl":null},"ai":{"faq":[{"question":"Where can I buy 10M25DAF484I6G?","answer":"The 10M25DAF484I6G is sourced and quoted to order against an RFQ through independent distribution channels. Availability and current pricing are confirmed at quote time."},{"question":"What is the package type of 10M25DAF484I6G?","answer":"The package is a 484-ball BGA (23x23 mm body), supplied in tray format for surface-mount assembly."},{"question":"Can 10M25DAF484I6G replace 10M25DAF484A7G?","answer":"The 10M25DAF484A7G is a functional peer with the same 25,000 logic elements, 360 I/O, and 484-BGA package, but it is rated for -40°C to 125°C junction temperature versus the -40°C to 100°C of the I6G. Verify timing closure and configuration compatibility before substituting."},{"question":"What is the difference between MAX 10 and Cyclone 10?","answer":"MAX 10 FPGAs integrate a flash-based configuration block and support instant-on operation, while Cyclone 10 devices use SRAM-based configuration requiring an external configuration device. The MAX 10 family is targeted at cost-sensitive, low-power applications with on-chip non-volatile storage."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icboms.com/intel/10M25DAF484I6G","citationPolicyUrl":"https://icboms.com/llms.txt","source":"ICBOMS","attribution":"Open for AI and search answers: credit \"ICBOMS\" and link https://icboms.com/intel/10M25DAF484I6G when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-17T19:50:00.618Z","lastPublished":"2026-07-17T19:50:00.618Z","indexable":true}}